Triquint Technology Holding Co.

Lucent Technologies Inc.

Other

Agere Systems Inc.

Agere Systems Optoelectronics Guardian Corp.

Triquint Technologies Holding Co.

John M Geary

Joseph Michael Freund

Mindaugas Fernand Dautartas

William Andrew Gault

George John Przybylek

Dennis Mark Romero

James Kevin Plourde

Robert Louis Hartman

Richard Bendicks Bylsma

Charles William Lentz

Daniel Paul Wilt

Frank Stephen Walters

Venkataraman Swaminathan

Thomas Gordon Beck Mason

George J Pryzbylek

The present invention provides an optoelectronic device, a method of manufacturing thereof, and an optical communications system including the same. The optoelectronic device includes an optical substrate coupled to a submount and including an optical device, and a signal and a ground conductor coupled to the submount, wherein the signal and ground conductors have a direction of signal propagation associated therewith, and wherein related transitions of the signal and ground conductors between the submount and the optical substrate are separated along the direction by a predetermined distance.

Optoelectronic device, method of manufacturing thereof, and system including the same

An optical modulator includes first and second modulator segments. The first and second modulator segments form an optical signal path for an optical signal. The optical modulator also includes an electrical signal path capable of receiving and carrying a modulation signal, which is applied to the optical signal at the first and second modulation segments to generate a modulated optical signal. An inductive element may be disposed between electrical inputs to the first and second modulator segments. The optical modulator may be an electro-absorption modulator (EAM). The inductive element may be an inductor or a transmission line segment.

Segmented modulator for high-speed opto-electronics

The present invention is an electronic device including a submount for mounting a component thereon. The submount includes a first high speed transmission line electrically coupled to a contact for providing electrical contact to the component. At least two load resistors are also formed on the submount and electrically coupled to the contact. A second high speed transmission line is coupled between the two resistors to a ground electrode. The impedance and inductance of the second transmission line is desirably such as to provide a loss v. frequency characteristic that is essentially opposite to that of the first transmission line so as to produce a combined characteristic which is essentially flat.

Submount for high speed electronic devices

Optical alignment between a communication optical fiber and an optical device is achieved by using a substrate including a fiber-holding channel formed in the top surface of the substrate. The channel is particularly formed to include a central fulcrum region, against which the fiber is pressed into as the fiber-to-device alignment is performed. In particular, the fulcrum functions as a pivot point to allow for the free endface of the fiber nearest the optical device to be adjusted (performing a 'fine' adjustment) by manipulating the opposing end of the fiber (using a 'gross' movement) until alignment with the optical device is achieved. A reduction of, for example, 14:1 between the gross movement and the fine adjustment can be achieved by using the inventive fulcrum structure.

Fiber alignment using a channel incorporating a fulcrum structure

A device, such as an optoelectronic device, including a submount and a cover, and a method of manufacture of such a device. The submount includes a substrate with a groove formed in the substrate. The substrate further includes at least one cavity formed in the substrate displaced from but in sufficiently close proximity to the groove so that a controlled amount of liquid adhesive, such as epoxy, in the cavity wicks into the groove when the cover is placed over the cavity and groove.

Devices and method of mounting

Flexible ground connectors are adapted to withstand temperature-induced stresses. The connectors may be formed of low thermal conductivity materials. The connectors may be used within a semiconductor package that also encloses a thermoelectric cooling device, a conductive submount, and a semiconductor light source. The submount may be grounded to the package wall by locating a pair of the flexible ground connectors across a gap to a ledge in the wall. The ground connectors may be formed of stainless steel, and they may be gold plated for improved electrical conductivity.

Method for reducing thermal loss and providing mechanical compliance in a semiconductor package and the semiconductor package formed therefrom

An optical microwave package eliminates launching electrical modes into a microwave strip-line by forming a moat in a housing portion of the package to suppress microwave resonant energy. The moat can be filled with a conductive material to further suppress package resonances. Additionally, the bottom of a substrate positioned within the housing is isolated from any conductive metal to further suppress microwave resonant energy.

Resonance elimination in high speed packages

An apparatus and method for performing tests on laser chips that are not labor intensive and will not result in wasted parts should the laser chip fail the test is disclosed. A &ldquo;bare&rdquo; laser chip is subjected to a test in accordance with one embodiment by placing the laser chip on an insulating material with an embedded conducting contact through which the current to power the laser chip is passed. A cover plate provides a channel around the laser chip through which a jet of high pressure inert gas is passed to dissipate the self-heating of the laser chip that occurs during the test process. The laser chip is kept in place by physical pressure. In accordance with another embodiment, the temperature of the laser chip is measured and a thermoelectric cooler is used to cool the laser chip. The test on the &ldquo;bare&rdquo; laser chip eliminates the need to solder bond the laser chip to a carrier and attach wire bonds to the laser chip, thus reducing associated labor and parts costs.

Apparatus and method for testing semiconductor laser chips

A method and apparatus are provided for automated cleaving of semiconductor laser bars into laser devices. The structures to be cleaved are sandwiched between two sheets of plastic film and, while supported on a stabilizing surface, are transported between the sheets in a direction perpendicular to scribe marks defining the sides of the laser devices. At one point, the film sheets with the structures between them pass over a raised breaker assembly on the stabilizing surface. A high pressure air source above the breaker assembly provides a blast of air towards each film sheet enclosed structure as it passes over the breaker assembly. This causes the structure to fracture or cleave along the scribe line. As the film sheet pass over the breaker assembly, the structure is cleaved at each successive scribe line. Thus, downstream of the breaker assembly, there are provided a series of separated devices between the two film sheets. Moreover, there is no possibility that the devices will be displaced as a result of any air currents, since they are securely retained between the two film sheets.

Apparatus for cleaving laser bars

A laser test probe is configured to include an electronic probe and a pair of optical fibers. The electronic probe is a high speed transmission line that is used to provide the required bias signal, as well as an RF test signal, to a laser being tested. The optical fibers are used to capture the optical output signals from the front and rear faces of the laser. These optical signals are then analyzed by a measurement control unit to assess the performance of the device under test. In its most basic embodiment, the test probe can be used to identify lasers that exhibit an insufficient (in the extreme, non-existent) optical output signal.

Laser testing probe

The invention is a laser with improved turn-on time for digital applications. The low bias capacitance effect of the laser is reduced by use of a buffer region formed between the substrate and the active region, the buffer region having a lower dopant concentration than the substrate.

Growing community of inventors

Macungie, PA, United States of America

John M Geary