Oxy Metal Industries Corporation

John M Deuber

Peter Stevens

Donald G Foulke

Kathleen Regina Rosikiewicz

The instant invention is particularly directed to a palladium electroplating bath and a method of plating therewith. The bath comprises essentially pure palladium free of alloying elements thereof and being in electrodepositable form, as well as a Class I brightener selected from the group consisting of methylene bis(napthlene sodium sulfonate), sodium benzene sulfonate, benzene sulfonimide and phenyl-sulfonic acid and a Class II organic brightener selected from the group consisting of benzaldehyde-o-sodium sulfonate, 2-butyne-1, 4-diol, 2 butene-1,4- diol and allyl sulfonate in order to improve the brightness of the deposit. The bath is particularly effective in plating palladium and alloys thereof.

Bright palladium electroplating baths

Disclosed is an aqueous electroplating bath and process for obtaining bright deposits of silver-gold alloys. The bath contains a polyakylene imine and an alkylene polyamine.

Bright low karat silver gold electroplating

Disclosed is a palladium electroplating bath and a method of plating therewith. The bath contains palladium as the palladosammine chloride and a phosphonic compound which is an alkylene diamine phosphonate derivative. The bath may be employed to plate palladium or its alloys. In a preferred embodiment, a pure palladium deposit may be obtained which exhibits very low porosity even after subsequent cold forming of the article on which it is deposited.

Electrodeposition of palladium

Disclosed is an aqueous electroplating bath suitable for plating a tin-gold alloy and a process of plating employing that bath. The bath contains gold as the auricyanide complex and tin as a stannic halide complex. The bath is operated at a pH value not in excess of 3. Where desired, the bath also contains a brightener. The electroplating bath is extremely stable and produces high quality electrodeposits.

Tin-gold electroplating bath and process

Disclosed is an improved electroplating bath and process for obtaining semi-bright to bright electrodeposits of gold and gold alloys. The electroplating bath contains a gold sulfite complex and a nitrogen-free diphosphonic compound having at least two phosphonic groups attached directly to a carbon atom. Presence of the nitrogen-free phosphonate compound enhances the stability of the gold sulfite baths and improves the brightness of electrodeposits obtained therefrom.

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Nutley, NJ, United States of America

John M Deuber