Skorpios Technologies, Inc.

Emcore Corporation

University of Illinois

Other

John M Dallesasse

Stephen B Krasulick

Timothy Creazzo

Elton Marchena

Joseph Scheibenreif

Bryan Noble

Amit Mizrahi

John Y Spann

William J Kozlovsky

Nick Holonyak, Jr

Dean A Richardson

Thomas Whitehead

Anthony Moretti

Paul W Wachtel

Brett Lane

Guoliang Li

David McCallum

Majid Sodagar

Murtaza Askari

Bogdan Andrei

Wenyi Wang

Changyi Li

Yi Wang

Benjamin Kesler

Thomas O'Brien, Jr

Matthew Block

Brian T Cunningham

Milton Feng

Daniel McGlynn

John Michael Iannelli

Jean-Pierre Leburton

Victor C Elarde

M Michelle Haugen

John Mszal

David S Mccallum

Noren Pan

Christopher Youtsey

A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector.

Heterogeneous bonding for photonic integration

A polarization-independent, optical circulator is formed in silicon photonics. The polarization-independent, optical circulator uses an optical splitter having two couplers and two waveguides joining the two couplers. One of the two waveguides is thinner than the other to create a large effective index difference between TE and TM modes transmitted through the one waveguide. Polarization rotators, including reciprocal and/or non-reciprocal rotators, are further used to create the optical circulator.

Monolithically-integrated, polarization-independent circulator

A composite device for splitting photonic functionality across two or more materials comprises a platform, a chip, and a bond securing the chip to the platform. The platform comprises a base layer and a device layer. The device layer comprises silicon and has an opening exposing a portion of the base layer. The chip, a material, comprises an active region (e.g., gain medium for a laser). The chip is bonded to the portion of the base layer exposed by the opening, such that the active region of the chip is aligned with the device layer of the platform.

Integration of an unprocessed, direct-bandgap chip into a silicon photonic device

Heterogeneous substrate bonding for photonic integration

Photonic rotators integrated on a substrate are disclosed for manipulating light polarization.

Systems and methods for photonic polarization rotators

A composite device for splitting photonic functionality across two or more materials comprises a platform, a chip, and a bond securing the chip to the platform. The platform comprises a base layer and a device layer. The device layer comprises silicon and has an opening exposing a portion of the base layer. The chip, a material, comprises an active region (e.g., gain medium for a laser). The chip is bonded to the portion of the base layer exposed by the opening such that the active region of the chip is aligned with the device layer of the platform. A coating hermetically seals the chip in the platform.

Fabricating a multilevel composite semiconductor structure includes providing a first substrate comprising a first material; dicing a second substrate to provide a plurality of dies; mounting the plurality of dies on a third substrate; joining the first substrate and the third substrate to form a composite structure; and joining a fourth substrate and the composite structure.

Multilevel template assisted wafer bonding

The present disclosure describes the design, fabrication, and demonstration of a compact spectroscopic analysis system that utilizes a linear variable filter chip attached directly over an image sensor array, and an integrated broadband LED illuminator that supplies light from the edge of the system to provide a low vertical dimension. The instrument is capable of accurately measuring the optical absorption spectra of colored liquids or the scattered spectra from solid objects that are placed in the illumination pathway. Due to the small vertical thickness of the system, the low cost of its components, and the accuracy with which it renders spectra in comparison to conventional spectrometers, we envision potential incorporation of the system into mobile communication devices, such as smartphones and tablets, as a means for providing a dedicated sensor for health diagnostic, environmental monitoring, and general-purpose color sensing applications.

Integrated spectroscopic analysis system with low vertical height for measuring liquid or solid assays

This disclosure relates to semiconductor quantum cascade lasers (QCLs). A three-terminal QCL device is disclosed. The three-terminal QCL device includes a unipolar multi-period quantum cascade laser structure embedded in a bipolar structure having three terminals providing at least two independently controllable biases to the QCL device for adjusting the lasing intensity and for tuning the lasing wavelength of the QCL device. The three-terminal QCL device further includes a quantum impedance matching structure for achieving high efficiency carrier injection and lowering lasing threshold. In addition, the multi-period quantum cascade laser structure is selectively doped to provide near charge neutrality during operation. The three-terminal QCL may further be controlled to achieve simultaneous dual- or multi-color lasing.

Quantum impedance matching for carrier injection in tunable transistor-injected quantum cascade lasers

Aspects of the subject disclosure may include, for example, a first distributed Bragg reflector, a second distributed Bragg reflector, an active region with an oxide aperture between the first and second distributed Bragg reflectors, and a dielectric layer, where a positioning of the dielectric layer with respect to the first and second distributed Bragg reflectors and the oxide aperture causes suppression of higher modes of the vertical-cavity surface-emitting laser device. Other embodiments are disclosed.

Mode control in vertical-cavity surface-emitting lasers

Hybrid integrated optical device

An integrated non-reciprocal polarization rotator comprises a substrate, a Faraday crystal, a first waveguide, and a second waveguide. The substrate has a recess extending to a predetermined depth. The Faraday crystal is mounted in the recess and optically coupled with the first waveguide and the second waveguide.

A method for fabricating a photonic composite device for splitting functionality across materials comprises providing a composite device having a platform and a chip bonded in the platform. The chip is processed comprising patterning, etching, deposition, and/or other processing steps while the chip is bonded to the platform. The chip is used as a gain medium and the platform is at least partially made of silicon.

Processing of a direct-bandgap chip after bonding to a silicon photonic device

A composite photonic device comprises a platform, a chip, and a contact layer. The platform comprises silicon. The chip is made of a III-V material. The contact layer has indentations to help control a flow of solder during bonding of the platform with the chip. In some embodiments, pedestals are placed under an optical path to prevent solder from flowing between the chip and the platform at the optical path.

Structures for bonding a direct-bandgap chip to a silicon photonic device

Growing community of inventors

Wheaton, IL, United States of America

John M Dallesasse