Krautkramer Branson, Inc.

John M Cuffe

Wolf-Dietrich Kleinert

Alan D Weiner

Theodore L Ballenger

Mark H Feydo

Apparatus (10) for processing a return waveform generated by directing an ultrasonic pulse at an object (S) under test. A signal converter (12) converts the return waveform from an analog to a digital signal. The analog-to-digital conversion rate is approximately four times the operating frequency of the ultrasonic pulse. A signal processor includes a plurality of digital signal processors (14,16,18) each of which is separately controllable to process the converted digital signal. A communications network (20) directs the analog signal, converted digital signal, and an output signal from the signal processor to a visual display (28) and to various peripheral equipment (A1,A2) connected to the apparatus. A process controller (22) controls routing of these signals to and from the signal processor over the communication network. By processing a return waveform, peak amplitude values representing flaws or imperfections in the object can be determined and the processed waveform, including peak values, displayed.

Signal processing apparatus for ultrasonic flaw detection system

Apparatus (10) for performing ultrasonic flaw testing of a material (M) or assembly. A pulser (28) generates an electrical pulse having defined characteristics. A transducer (12) converts the signal to an ultrasonic pulse, propagates the pulse through the material or assembly, receives an echo the characteristics of which include reflections off flaws or discontinuities in the material or assembly, and converts the echo into an electrical reply signal. The transducer is selectable from among a number of transducers. A processor (32) processes the reply signal to produce a visual display representing the amplitude of the reply signal for a range of propagation times (distances) into the material. A visual display (16) displays the processed electrical signal. A correlation module (42) generates a gate signal which is visually displayed (at 38) with the processed electrical signal. The gate signal corresponds to a maximum amplitude value which represents the maximum flaw size allowable for the test. If the displayed amplitude of the processed electrical signal exceeds the maximum amplitude value, the material or assembly fails the test. The correlation module emulates a series of DGS curves for the transducer used during the test. This is done to take into account test parameters related to the transducer and the material, so after an initial calibration of the apparatus is performed using a selected transducer and a reference reflector, valid test results are obtained with the transducer regardless of the distance of the reflector.

Growing community of inventors

State College, PA, United States of America

John M Cuffe