Intersil Corporation

John M Coronati

Sampat S Shekhawat

John J Tumpey

A package for mounting a power semiconductor device to a printed circuit board comprises a dielectric ceramic plate having an upper and lower surface and a grid array of holes penetrating the plate. A plurality of conductive metal contact pads that provide electrical contact for the power semiconductor device are disposed on the upper surface of the ceramic plate, and a conductive metal fills the holes. The metal-filled holes are connected to the conductive metal contact pads and provide vias from the pads to the lower surface of the ceramic plate. An array of solder balls, each ball being attached to a via at the lower surface of the ceramic plate, provide connection terminals to the printed circuit board. Sidewalls are sealably connected to the ceramic plate at its perimeter, and a lid is sealably connected to the sidewalls. The lid comprises, together with the sidewalls and ceramic plate, a hermetically sealed cavity that encloses the power semiconductor device and conductive metal contact pads.

Power semiconductor mounting package containing ball grid array

A power module includes a semiconductor substrate and spaced power transistor circuits formed in the substrate, each having respective anode and cathode portions. A power module housing substantially encloses the substrate. Flexible cathode straps and flexible anode straps are connected to the respective anode and cathode portions and extend out of the power module housing spaced from each other. At least two anode straps and cathode straps fold over at least a portion of the power module housing to overlap each other and form phase straps. The remaining cathode and anode straps fold over at least a portion of the power module housing such that respective cathode and anode straps overlap each other, thereby lowering inductance and reducing voltage overshoots at turn off.

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Mountaintop, PA, United States of America

John M Coronati