At&t Bell Laboratories

Bell Telephone Laboratories

American Telephone and Telegraph, Co.

John M Andrews, Jr

Gerald Smolinsky

Nadia Lifshitz

Frederick Vratny

Simon M Sze

San-Chin Fang

Robert Morgan Ryder

In an electronic circuit that normally includes a high-value resistor, the resistive function may be usefully provided by a thin dielectric layer. Electric current is transported through the layer by quantum tunneling. In one embodiment, a resistor useful for VLSI applications is provided, requiring only a single contact window.

Article comprising a high value resistor

The TVS method is a voltammetric method for detecting mobile ionic impurities in the dielectric layer of a MOS capacitor structure. Disclosed here is a method of semiconductor device fabrication involving a modified TVS method in which the voltage is changed in discrete steps rather than varied continuously, and charge, rather than induced current, is measured. The modified TVS method can be faster than conventional TVS, and calibration is unnecessary.

Method of manufacturing semiconductor devices involving the detection of

Disclosed is a method of semiconductor device fabrication involving the detection of water in a dielectric layer that is part of the body of such device. At relatively high values of a voltage applied across the dielectric layer, water that is present in the dielectric decomposes and releases protons. Varying the applied voltage gives rise to a displacement current. The released protons contribute an ionic component to the displacement current. The ionic component is detected.

Method of manufacturing semiconductor devices, involving the detection

A fabrication process for making palladium-plated target anodes for X-ray lithographic systems is characterized by a unique sequence of surface preparation, plating and annealing steps. Anodes made by the process have been operated reliably at high-power levels for extended periods of time.

Fabrication of palladium anode for X-ray lithography

A Schottky barrier contact includes a thin layer of high carrier concentration impurities ion implanted over the contact surface of the semiconductor. This reduces the electronic barrier height, increases the tunneling component, and thus reduces the forward-bias turn-on voltage of the diode. The implanted layer has a carrier concentration at least ten times that of the semiconductor substrate, and a thickness smaller than the width of the inherent depletion region resulting from the internally generated electric field at the metal-semiconductor interface. An implanted layer of the opposite conductivity type raises the barrier height.

Growing community of inventors

Watchung, NJ, United States of America

John M Andrews, Jr