Centre National De La Recherche Scientifique

Universitë De Bordeaux

Amplitude

Alphanov Institut D'optique D'aquitaine

Centre Hospitalier Universitaire De Bordeaux

Alphanov

Centre Technologique Alphanov

John Lopez

Clemens Honninger

Eric Mottay

Eric Audouard

Bruno Chassagne

Rainer Kling

Guillaume Duchateau

Clémentine Javaux-leger

Ophélie Dematteo-caulier

Konstantin Mishchik

David Touboul

Donetsi Iribarren

Guillaume Bonamis

Konstantin Mishchick

Disclosed is a method for cutting dielectric or semiconducting material with a laser. The method includes the following steps: emission of a laser beam including at least one burst of N femtoseconds laser pulses; spatial separation of the laser beam into a first split beam having a first energy, and respectively, a second split beam having a second energy; spatial concentration of energy of the first split beam in a first zone of the material, respectively, of the second split beam in a second zone of the material, the first zone and the second zone being separate and staggered by a distance dx; and adjustment of the distance between the first zone and the second zone in such a way as to initiate a straight micro-fracture oriented between the first zone and the second zone.

Method and appliance for cutting materials by multi-beam femtosecond laser

Growing community of inventors

GRADIGNAN, France

John Lopez