Other

Element Six Technologies Limited

Element Six Gmbh

John Lloyd Collins

Daniel James Twitchen

Geoffrey Alan Scarsbrook

Philip Maurice Martineau

Andrew John Whitehead

Ricardo Simon Sussmann

Christopher John Howard Wort

Bärbel Susanne Charlotte Dorn

Barbel Susanne Charlotte Dorn

Barbel Susanne Dorn

Michael Andrew Cooper

Michael Cooper

Ricardo Simon Sussman

Graeme David Dufferwiel

Charles Gerard Sweeney

Bärbel Susanne Cha Dorn

Andrew Michael Cooper

A method of fabricating a plurality of single crystal CVD diamonds, the method comprising: coating a carrier substrate with a layer of polycrystalline CVD diamond material; bonding a plurality of single crystal diamond substrates to the layer of polycrystalline CVD diamond material on the carrier substrate; growing single crystal CVD diamond material on the plurality of single crystal diamond substrates to form a plurality of single crystal CVD diamonds; and separating the plurality of single crystal CVD diamonds from the layer of polycrystalline CVD diamond material on the carrier substrate and any polycrystalline CVD diamond material which has grown between the plurality of single crystal CVD diamonds to yield a plurality of individual single crystal CVD diamonds.

Method of fabricating a plurality of single crystal CVD synthetic diamonds

A single crystal diamond prepared by CVD and having one or more electronic characteristics; making the diamond suitable for electronic applications. Also provided is a method of making the single crystal CVD diamond.

Single crystal diamond prepared by CVD

A layer of single crystal CVD diamond of high quality having a thickness greater than 2 mm. Also provided is a method of producing such a CVD diamond layer.

Thick single crystal diamond layer method for making it and gemstones produced from the layer

This invention relates to diamond and more particularly to diamond produced by chemical vapour deposition (hereinafter referred to as CVD). According to a first aspect of the invention, there is provided a layer of single crystal CVD diamond of high quality having a thickness of at least 2 mm.

A method of bonding a diamond compact comprising a polycrystalline mass of diamond and a bonding phase which contains free-silicon to a substrate is provided. The method includes the steps of contacting a surface of the compact with carbon or nitrogen or a mixture thereof under conditions suitable to cause free-silicon in the surface to react with the carbon and/or nitrogen and thereafter bonding that surface to the substrate, preferably by means of a braze. In a preferred form of the invention, the surface which is bonded to the substrate is acid cleaned after contact of that surface with carbon or nitrogen or a mixture thereof.

Bonding a diamond compact to a cemented carbide substrate

A diamond-containing body is provided which is useful particularly as a tool insert. The body comprises a layer of CVD diamond presenting a working surface defining a cutting edge. The layer of CVD diamond is bonded to a substrate along an interface. A pattern of spaced, curved grooves extends from the interface into the substrate up to a depth of 200 microns and extends across substantially the whole of the interface.

Diamond-containing body

A CVD diamond layer for use as an insert in an abrasive tool characterized by the following features:

Diamond

Planar microwave antennas are described of the type formed from a plurality of moulded planar layers. A first layer defines horn elements and two underlying layers define waveguide channels communicating with the horn elements. The waveguide channels are formed at the interface between layers by aligned channels in the abutting surfaces. The surfaces of at least the horns and waveguide channels are metallised, and the layers may be secured together by rib welding.

Planar horn array microwave antenna

A flat phased array antenna for reception of circularly polarized high frequency signals. The flat antenna array consists of a number of subarrays arranged in a matrix. In turn, each of the subarrays consist of individual antenna elements arranged in a matrix. In one embodiment, each subarray consists of four layers stacked one on top of the other. The top layer defines an array of miniature reception horns. Secured to the top layer is a second layer which constitutes the short-circuit plate of the antenna array. The short-circuit plate contains a plurality of through holes disposed about the surface of the circuit plate to permit passage of pairs of cylindrically shaped probes. The two remaining layers constitute the first power dividing layer and the second power dividing layer, respectively. Each of the layers includes transmission line waveguides. The complete interior surface of the waveguides is coated with a metallic film and contains a number of spaced non-conductive supports for supporting a metallic conductor at the central location of the waveguide when the channel is viewed in cross-section. This arrangement creates a rectangular coaxial transmission line with the conductor forming the central conductor and the metallically coated channel forming the outer conductor. At the end of certain channels are the vertically extending, cylindrically shaped non-conductive probes. In a second embodiment, non-conductive strips with spaced supports carry the conductor. The probes are intengrally formed as part of the non-conductive strips. In still another embodiment, the probes of the first embodiment are replaced by conductive legs formed in the same plane as the metallic conductor. In addition, the two channels are formed along both sides of a single layer and recessed into that layer.

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London, United Kingdom

John Lloyd Collins