Hexcel Composites Limited

Hexcel Corporation

Other

Conductive Inkjet Technology Limited

Hexcel Corporatioin

John Leslie Cawse

Martin Richard Simmons

George Green

Stephen Mortimer

Philip Hadley

Michelle M Irons

Graham Kemp

George E Green

John Ellis

Mark Whiter

Steve Mortimer

Neal Patel

Chrisopher J Wade

Terence Charles Webb

Terrence Charles Webb

David Rowland

Ian Rees

Xiuyan Sun

Tanya Batchford

Ayub Khan

Martin Simmons

One or more layers of structured thermoplastic polymer are located within the interleaf zones of a preform or prepreg. The structured thermoplastic polymer is a film or membrane formed by: a) dissolving polyethersulfone or polyetherimide in a solvent to form a polymer dope; b) dispersing a curing agent for an epoxy resin in the polymer dope to form a curative-enriched polymer dope; c) casting the curative-enriched polymer dope onto a surface to form a dope layer; and d) removing the solvent from the dope layer to form a layer of structured thermoplastic polymer.

Structured thermoplastic in composite interleaves

One or more layers of structured thermoplastic polymer, such as a light weight veil of thermoplastic polymer fibers, are located within the interleaf zone of laminates that are composed of fibrous layers and thermosetting resin. The thermoplastic veils are used in the interleaf zones as a replacement for thermoplastic toughening particles.

A composite material, the composite material comprising at least one prepreg, said prepreg comprising at least one polymeric resin and at least one fibrous reinforcement; and conducting particles dispersed in the polymeric resin.

Composite materials

A non-fibrous, apertured membrane comprises at least one thermoplastic polymeric material and has a discrete porous structure. The membrane is soluble in the thermoset matrix polymer of a composite material.

Thermoplastic toughening material and related method

A curable resin comprising a compound having the structure wherein each carbon 2, together with either its carbon 1 or carbon 3, are members of a fused cycloaliphatic ring, and when carbon 1 is a member of the ring so is N, and wherein each of the aliphatic or aromatic ring-member carbons may either be members of further fused cycloaliphatic rings or be bonded to a group selected from H or linear or branched Cto Calkyl.

Curing agents

A resin material is provided which comprises at least one thermoset resin, carbon conductive additive material, and at least one thermoplastic polymer resin. The thermoplastic polymer resin dissolves in the thermoset polymer resin and phase separates upon cure. There is also provided a method of making the resin material, and additionally a composite material that comprising said resin material in combination with a fibrous reinforcement. The resin material and composite material may each be used in an uncured or cured form, and may find particular use as a prepreg material.

Conductivity of resin materials and composite materials

The invention provides a prepreg comprising matrix and fibers, having deposited thereon a plurality of regions raised at least 5 micrometers relative to the surface of the matrix, a method of preparing such a prepreg, a method of curing a laminate of a plurality of such preprags and the cured laminate produced by such a method.

Prepregs

The invention relates to a resin curing agent having the formula (I), wherein Rto Rare each individually selected from linear or branched Cto Calkyl, a process for its manufacture, blends of the reaction products, and two-component curable resin systems. 

A curable resin comprising a curing agent, wherein the curing agent comprises an adjustable structural unit having a stable chain-like arrangement which is adjustable to a stable ring-like arrangement, wherein the ring-like arrangement comprises the constituents of the chain-like arrangement with two terminal constituents exhibiting an attractive chemical interaction, and is adjustable back from the ring-like arrangement to the chain-like arrangement by separation of the two terminal constituents.

Resin curing agents

Thermosetting resins are provided that are toughened with an irradiated thermoplastic toughening agent and which have reduced levels of solvent-induced micro crack formation. The thermoplastic toughening agent is treated with a sufficient amount of high-energy radiation (e.g. electron beam or gamma rays) to cause a reduction in solvent-induced micro crack formation in the cured resin when compared to the same toughened thermosetting resin in which the non-irradiated version of the thermoplastic toughening agent is used.

Thermosetting resin containing irradiated thermoplastic toughening agent

An epoxy resin composition comprising an epoxy resin component combined with a sufficient amount of an imidazole curative to provide curing of the epoxy resin composition. The epoxy resin composition further includes a non-hydroxyl containing cure accelerator for the imidazole curative.

Cure accelerators

A composite material () comprising at least one prepreg (), said prepreg comprising at least one polymeric resin and optionally at least one fibrous reinforcement; and a conducting ink () applied to at least one surface of said prepreg (); where the conducting ink () has a surface tension lower than the surface energy of the at least one surface of said prepreg () to which the ink () is applied.

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Castle Camps, United Kingdom

John Leslie Cawse