Tokyo Electron Limited

John Lawson

Stanislaw Kopacz

Dale Irwin

Steve Chervenak

Michael Landis

John McIntee

Rodger Eckerson

The present invention presents an adaptable processing element for use in a processing system having multiple configurations. The processing element comprises a primary component and at least one detachable component, wherein the at least one detachable component can be retained for one configuration and removed for another configuration. For example, the detachable component may include a punch-out or knock-out located on a right-hand side and a left-hand side of a processing element in order to permit access of a gas supply line to a processing chamber for either a right-hand orientation or a left-hand orientation, respectively. Additionally, for example, the detachable component, whether retained or removed, can permit flexible use with different size processing chambers.

Adaptable processing element for a processing system and a method of making the same

An adapter assembly is provided for supporting a sputtering cathode in a fixed opening in the chamber of a sputter coating machine. The assembly includes: one of several adapter bodies, each configured to support, in the fixed opening, a target of one of a plurality of sizes and types, and at one of several target-to-substrate spacings; one of several insulator rings, each for a target of a different size or type; one of several dark-space shields, each for a target of a different size, type, material, or processing pressure; and one of several adapter shields, each for a different adapter body and target material. Only the shields accumulate deposits and require cleaning or replacement. The dark-space shield is spaced from the target rim by a gap of at 0.045 to 0.067 inches to form a deep narrow space that prevents deposits onto the insulator ring while avoiding arcing and plasma formation in the gap. A method is provided for existing sputtering machines with the assembly, which accommodates different targets and processes.

Sputtering cathode adapter assembly and method

A replacement chamber shield is provided for a wafer processing machine that replaces many prior art shield components with a single piece shield. The shield is particularly suitable for use in a processing chamber of a vacuum processing machine of a type for processing a wafer in a vertically-oriented split-plenum, such as machines of the type described in U.S. Pat. Nos. 4,909,695 and 4,915,564 and the machine marketed under the trademark ECLIPSE MARK II by Tokyo Electron Limited. The shield is formed of sheet material formed into an axially-extending cylindrical sidewall that turns radially inwardly into an annular shoulder that oppositely turns into an at least partially axially-extending section that further turns oppositely back radially inwardly into an annular disc having a central circular opening that is larger in diameter than the given wafer diameter. Advantageous dimensions and geometric relationships to components of the machine are described and claimed.

Single piece pod shield for vertical plenum wafer processing machine

A method of securing a substrate in a semiconductor processing machine. The method includes moving latch bodies between latched and unlatched positions while permitting contact between a clamping member of each latch body and the substrate only if the latch bodies are substantially in the latched position. In the latched position, the clamping members apply a clamping force effective to secure the substrate. Generally, contact is prevented by engagement between a support member and an ramp that is inclined such that the clamping member descends toward the substrate as the latch body moves from the unlatched position to the latched position and only contacts the substrate as the latched position is established.

Method of securing a substrate in a semiconductor processing machine

A semiconductor wafer holding assembly that secures a semiconductor wafer for wafer handling by a semiconductor processing machine. The wafer holding assembly includes a clamp ring that is mounted to a support frame and that has a wafer-engaging surface. A plurality of latch assemblies are mounted about the periphery of the clamp ring and adjacent to the wafer-engaging surface. Each latch assembly includes a latch body that carries a clamping roller assembly and a supporting roller assembly. A rolling element of the supporting roller assembly rolls along a circular path on an inclined surface on the clamp ring as the latch body is rotated through a pivot arc between an unlatched position and a latched position. Unless the latch body is positioned in the latched position, the rolling engagement between the supporting roller assembly and the inclined surface suspends the rolling element of the clamping roller assembly above the wafer surface until the latch body is in the latched position. When the latch body is in the latched position, the rolling element of each clamping roller assembly contacts the wafer surface with a clamping force sufficient to secure the semiconductor wafer in the wafer holder.

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Chandler, AZ, United States of America

John Lawson