The Charles Stark Draper Laboratory, Inc.

The Whitaker Corporation

John Lachapelle

Bryan McLaughlin

Tirunelveli Subramaniam Sriram

Brian R Smith

Jesse J Wheeler

Andrew Czarnecki

John R Burns, Iv

Brian Nugent

Caroline K Bjune

Philip D Parks, Ii

Jason Oliver Fiering

Mark Joseph Mescher

Amy Elizabeth Duwel

Douglas W White

David Frederick Jordan

Carlos A Segura

Daniel Joseph Guyon

Robert A Bousquet

Julianne Grainger

Brent Hollosi

Matthew Muresan

Joseph M Bauer

David Martin

Robert Bousquet

William Griffin

Finbarr McGrath

Frans Spaepen

Philip D Ii Parks

John Burns

Philips D Park

John Burns Iv

Brian Smith

The present disclosure discusses a method of manufacturing an implantable neural electrode. The method includes cutting a metal layer to form a plurality of electrode sites, contact pads and metal traces connecting the electrode sites to the contact pads. A first silicone layer including a mesh is formed and coupled to the metal layer. A second silicone layer is formed and laminated to the first silicone layer coupled with the metal layer. Holes are formed in the first or second silicone layer exposing the contact pads and electrode sites. Wires are welded to the exposed contact pads and a third layer of silicone is overmolded over the contact pads and wires.

Method of manufacturing an implantable neural electrode interface platform

An electrode array includes a body portion, at least one tail portion, at least one tissue surface contact, and at least one intratissue contact. The electrode array can provide stimulation or record signals from both the surface of a target tissue and within the target tissue. A system for tissue surface and intratissue signal recording and/or stimulation contains an electrode array, a controller or receiver, and at least one connection between the electrode array and the controller or receiver. A method of recording signals and/or stimulating tissue includes contacting the target tissue surface and target tissue interior with an electrode array and providing or recording an electrical, chemical, or optical signal.

Electrode array for surface and intratissue recording and stimulation

A lead assembly for networked implants may contain a controller, an implantable tissue contact system connected to the controller and including a plurality of leads, and a breakout connector connected to each of the plurality of leads, and further connected to a shared communication path. A physiological interface system may contain a controller and an implantable tissue contact system. Methods of treating a subject and monitoring a subject include transmitting signals between a controller and an implantable tissue contact system.

Lead assembly for networked implants

The present disclosure describes systems and methods for improving the safety of bio-implantable electronics systems used for recording and electrical stimulation applications. The present disclosure discusses a communication protocol that provides DC balanced, bi-directional communication between a controller hub and satellite electrical stimulation and recording devices distributed throughout the patient's body. The present disclosure also describes a system for detecting and preventing current leaks along electrical pathways that may pass into a patient.

Integrated power delivery, communication, and health monitoring system for implantable electrode

Systems and methods are disclosed herein for recording electrical signals in the presence of artifacts. The system and methods can employ multiple techniques for attenuating large, unwanted artifacts while preserving lower amplitude desirable signals. Aspects that can improve the recording of electrical signals in the presence of larger artifacts include particular electrode placement and spacing, high dynamic range amplification with good linearity, and signal blanking. Combinations of more or fewer techniques can be employed to achieve the desired attenuation of signal artifacts while preserving the desired signal. The systems and methods are suitable for recording neural signals in the presence of electrical stimulation signals.

Apparatus and method for recording neural signals in the presence of artifacts

A method for bonding a hermetic module to an electrode array including the steps of: providing the electrode array having a flexible substrate with a top surface and a bottom surface and including a plurality of pads in the top surface of the substrate; attaching the hermetic module to the bottom surface of the electrode array, the hermetic module having a plurality of bond-pads wherein each bond-pad is adjacent to the bottom surface of the electrode array and aligns with a respective pad; drill holes through each pad to the corresponding bond-pad; filling each hole with biocompatible conductive ink; forming a rivet on the biocompatible conductive ink over each pad; and overmolding the electrode array with a moisture barrier material.

Method for bonding a hermetic module to an electrode array

Systems and methods for modulating a physiological process are provided to enable precise delivery of signals to a predetermined treatment site. The systems may comprise an implantable device and an electrical lead body. The electrical lead body may comprise a plurality of transducer contacts in close proximity to an end of the electrical lead body, and a control unit positioned within the lead body in close proximity to the plurality of transducer contacts.

Distributed neuro-modulation system with auxiliary stimulation-recording control units

Methods for bonding a hermetic module to an electrode array

In various embodiments, an actuating mechanism is employed to displace a conductor disposed within a fluidic channel, thereby reconfiguring an electronic component.

Electronic devices, such as antennas, having fluidic constructs that permit reconfiguration of the devices

A GPS receiver (,) has an antenna (,) mounted directly on a first side (,) of a multilayer printed circuit board (PCB) substrate 2. Electrical conductors interconnect the antenna (,) with an RF processing system (,) and a digital processing system (,) mounted directly on a second side (,) of the PCB substrate (,). A position connector (,) is disposed on one side of the PCB substrate (,) and provides power, ground, and direct electrical access of processed GPS signals for an external system such as a mobile vehicle system.

Integrated global positioning system receiver

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Princeton, MA, United States of America

John Lachapelle