Motorola Corporation

John Kivlin

Kevin L Kent

Eric J Gasmann

A method for manufacturing an electronic device includes placing a plurality of components on a printed wiring board (,), detecting a defect in a component (,) and, in response, producing a defect indication including a defect location on the printed wiring board. Subsequently, additional components are placed on the printed wiring board (,) but placement of all additional components having a location which has a predetermined relation with the defect location is suspended. The defective printed wiring board may then be repaired by a technician who subsequently places the additional components over the defect location. This reduces the need to apply a large amount of heat to the printed wiring board to remove subsequently placed components such as radio frequency shields. This further reduces the possibility of additional defects occurring during repair.

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Lake Geneva, WI, United States of America

John Kivlin