International Business Machines Corporation

Endicott Interconnect Technologies, Inc.

John Joseph Konrad

Timothy Leroy Wells

Konstantinos I Papathomas

Jeffrey McKeveny

Jose A Rios

James Warren Wilson

Norman A Card

Ralph A Barrese

Allen H Hopkins

Anilkumar Chinuprasad Bhatt

John Steven Kresge

John A Welsh

James W Fuller, Jr

Timothy Eugene Antesberger

Joseph Alphonse Kotylo

Stephen Krasniak

Gary Gajdorus

Robert C Schaffer

Bernd Karl Appelt

Roy H Magnuson

Amit Kumar Sarkhel

Michael Wozniak

Edmond Otto Fey

Andrew Michael Seman

Richard Allen Day

Kevin Taylor Knadle

Robert Douglas Edwards

Edward Lee Arrington

Robert Anthony Sinicki

Voya Rista Markovich

Jerzy Maria Zalesinski

John Gerard Gaudiello

Ross William Keesler

Stephen Joseph Fuerniss

James D Herard

James M Larnerd

Lawrence Robert Blumberg

Charles R Pigos, Jr

Robert J Harendza

Richard A Bartlett

Dominic A Casale

Donald R Olson

David A Space, Jr

Michael T Freeman

Narendra G Shah

Donald L Putman

Edmund Glenn Benjamin

Tonya L Mosher

Biebele Opubo Benebo

George Frederick Reel

Susan Pitely

A method of making a circuitized substrate in which the substrate includes circuit elements having exposed surfaces defined by two thin layers of permanent photoimaged solder mask material which are applied through fine mesh screens. The use of two thin layers assures effective coverage of the material to precisely expose the desired surfaces in high-density circuit patterns. A circuitized substrate assembly and an information handling system adapted for having one or more such assemblies therein are also provided.

Circuitized substrate assembly

A method of making a circuitized substrate in which conductors are formed in such a manner that selected ones of the conductors include solder while others do not and are thus adapted for receiving a different form of connection (e.g., wire-bond) than the solder covered conductors. In one embodiment, the solder may be applied in molten form by immersing the substrate within a bath of the solder while in another the solder may be deposited using a screening procedure.

Method of making circuitized substrate with selected conductors having solder thereon

A photoresist composition, e.g., a positive acting resist, for use in the formation of circuit patterns and the like on printed circuit boards and the like circuitized substrates, the photoresist composition including a quantity of silver therein in a sufficient amount to substantially prevent bacteria formation within said composition. A method of making the composition is also provided.

Photoresist composition with antibacterial agent

An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system. At least one selective shield material flow mechanism is used in a selective shield material flow assembly.

Selective shield/material flow mechanism

A method of plating a circuit pattern on a substrate to produce a circuitized substrate (e.g., a printed circuit board) in which a dual step metallurgy application process is used in combination with a dual step photo-resist removal process. Thru-holes are also possible, albeit not required.

Plating method for circuitized substrates

A method of making a circuitized substrate in which the substrate's commoning bar, used during the plating of the circuitry on the substrate, is terminated from the various conductors using a laser. In a preferred embodiment, the laser acts through a dielectric layer (soldermask) which is applied over the circuitry, including the commoning bar and connected parts. The laser may also be used to expose selected ones of the circuit's other parts, including various pads used to accommodate a wirebond (from a chip) and also solder balls for eventual placement of the substrate on a larger circuit board.

Method of making circuitized substrate

A method of making a circuitized substrate in which a commoning bar, used during the plating of the circuitry on the substrate and coupled to a second set of conductors which in turn are coupled to a first set of conductors, is terminated from the second set of conductors.

A method of making a circuitized substrate in which two solder deposits, either of the same or different metallurgies, are formed on at least two different metal or metal alloy conductors and PTHs. In an alternative embodiment, the same solder compositions may be deposited on conductor and PTHs of different metal or metal alloy composition. In each embodiment, a single commoning layer (e.g., copper) is used, being partially removed following the first deposition. The solder is deposited using an electroplating process (electroless or electrolytic) and the commoning bar in both depositing steps. An information handling system utilizing the circuitized substrate formed in accordance with the invention is also described.

Method of making a circuitized substrate having a plurality of solder connection sites thereon

A process for manufacturing a land grid array connector for a printed wiring board is disclosed. The process does not require electroplating precious metal overlays. Therefore, no commoning bar is required. Another benefit of the invention includes a connector design using only a flash, soft gold application in the outer surface of the connector. Physical hardness and durability are derived from a thin palladium layer lying beneath the flash gold layer.

Process for manufacturing a printed wiring board

A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is disclosed. The method includes forming an oxide layer on the set of second conductors; forming a solder mask on the oxide layer; forming a composite layer on the first set of conductors; and forming a solder layer on at least a portion of the third set of conductors.

Method of fabricating printed circuit board with mixed metallurgy pads

Embedded flush circuitry features are provided by providing a conductive seed layer on the sidewalls and bottom of laser ablated trench features plating a layer of conductive metal onto the seed layer and depositing a layer of dielectric material.

Structure having laser ablated features and method of fabricating

Embedded flush circuitry features are fabricated by providing a conductive seed layer on the sidewalls and bottom of laser ablated trench features plating a layer of conductive metal onto the seed layer and depositing a later of dielectric material.

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Endicott, NY, United States of America

John Joseph Konrad