The Charles Stark Draper Laboratory, Inc.

Other

Intevac, Inc.

John James Boyle

Juha-Pekka J Laine

Benjamin F Lane

Gregory P Blasche

Erik L Waldron

Paul A Bohn

Stephen P Smith

William L Robbins

Robin Dawson

Robin Mark Adrian Dawson

Verle W Aebi

Matthew T Jamula

Samuel W Harrison

Walter D Foley

Francis J Rogomentich

Sean McClain

Verie W Aebi

A digital camera optically couples a monocentric lens to image sensor arrays, without optical fibers, yet shields the image sensor arrays from stray light. In some digital cameras, baffles are disposed between an outer surface of a monocentric lens and each image sensor array to shield the image sensor arrays from stray light. In other such digital cameras, an opaque mask defines a set of apertures, one aperture per image sensor array, to limit the amount of stray light. Some digital cameras include both masks and baffles.

Hemispherical star camera

A star camera system that includes an optical system configured to focus radiation from a star to be imaged onto a collector. Specifically, the collector is in the form of an electron bombarded active pixel sensor (EBAPS) configured to provide high gain. The EBAPS comprising a photocathode disposed in a vacuum is configured to release electron into a vacuum when exposed to radiation focused thereon by the optical system. In addition, the EBAPS includes an active pixel sensor anode disposed distant from the photocathode in the vacuum. An electric field is generated by a voltage source to direct electrons from the photocathode to the active pixel sensor anode to thereby generate an image of the star.

Electron-bombarded active pixel sensor star camera

A star camera system that includes an optical system configured to focus radiation from a star to be imaged onto a collector that is in the form of an electron bombarded active pixel sensor (EBAPS) configured to provide high gain. The EBAPS comprising a photocathode disposed in a vacuum is configured to release electrons into the vacuum when exposed to radiation focused thereon by the optical system. The EBAPS includes an active pixel sensor anode disposed distant from the photocathode in the vacuum. An electric field is generated by a voltage source to direct the electrons from the photocathode to the active pixel sensor anode. Furthermore, the collector is mounted on a translation device configured to move the collector relative to the optical system by a predetermined amount of less than pixel size in the focal plane of the optical system to increase image resolution of a plurality of images.

High performance scanning miniature star camera system

A low light level system is described wherein electrons, created by images directed to a photocathode, directly bombard active pixel sensors. Both the active pixel sensors and the output end of the photocathode are positioned in a vacuum envelop. The electron released from the photocathode are directed to and at the active pixel sensors. The output of the active pixel sensor detector may be stored, viewed or displayed at a remote location. Various applications are described including a novel camera.

Electron bombarded active pixel sensor

An integrated circuit (IC) die carrier assembly includes a thinned IC die mounted to a substrate or carrier. The IC die is mounted to the carrier via a thin layer of glass. The carrier facilitates fixturing and provides support during the lapping process used to thin the die. Ball bonding, wire bonding, thin film or thick film conductors can be used to interconnect the pads on the IC die to the pads on the carrier. The coefficients of the thermal expansion of the IC die and the carrier are closely matched to avoid damage to the IC die due to uneven expansion of the thinned IC die relative to the carrier. The IC die carrier assembly is better suited for ultrahigh vacuum and high temperature environments than conventional IC die carrier assemblies.

Method for attaching a die to a carrier utilizing an electrically nonconductive layer

Intergrated circuit die assembly

A door security system for the protection of a lock as well as a set of hinges both associated with a door wherein the security system includes a wrap-around cover plate covering surface portions of the exterior and interior of the door adjacent the lock and the lock side surface around the bolt plate of the lock. In addition, structures designed to protect each of the plurality of hinges serving to hang the door on the hinge jamb thereof include a wrap-around cover plate and hinge pin fittings on the inside of the door and a jamb plate and a vertical bar attached to an exterior section which includes a bar surface that is adjacent to a vertically extensive, exterior surface end region of the hinge cover plate when the door is closed.

Door security system

Growing community of inventors

Bourne, MA, United States of America

John James Boyle