Microsoft Technology Licensing, LLC

Amazon Technologies, Inc.

Meta Platforms Technologies, LLC

John Jacob Nelson

David Otto Whitt, Iii

Ivan Andrew McCracken

Rahul R Marwah

Xiaoyue Xie

Matthew David Mickelson

Kevin M Bailey

Carl Edward Picciotto

Matthew Christopher Smith

Brian Cox

Aric Ahkeel Fitz-Coy

Heather Anne Ralph

Brad Nathaniel Arnold

Andrew E Winter

Tao Liu

Jingyu Zou

Daniel Joseph Peters

Gahn Gavyn Yun

Launnie K E Ginn

Timothy Carlyle Shaw

Turhan Karadeniz

Eugene Lee

Thomas Joseph Longo

Tamer Elazhary

Cameron Maehara Lee

Yujia Huang

Dong Zhang

Ivan Andrew Mccracken

David Otto Whitt

David Otto Iii Whitt

Brian Rush Cox

The disclosed computer-implemented method may include synchronizing a timing scheme between a display and a camera. The method may also include triggering, using a display trigger based on the timing scheme, the display to display a content frame, and triggering, using a capture trigger based on the timing scheme, the camera to capture the displayed content frame. The method may further include building a timeline of frame events for the displayed content frame and the captured content frame, and matching, using the timeline of frame events, the displayed content frame with the captured content frame. Various other methods, systems, and computer-readable media are also disclosed.

Synchronization of disparity camera

Techniques for a circuit board for an input device are described. In at least some embodiments, an input device is integrated into a circuit board of an apparatus. For instance, a touch interaction region of the input device is formed by cutting and/or etching a portion of the circuit board such that the touch interaction region is moveable with respect to adjacent portions of the circuit board. According to one or more embodiments, an input device includes a switch such that movement of the touch interaction region actuates the switch to generate a click input event.

Circuit board for an input device

During operation, a facility may utilize many sensors, such as cameras, to generate sensor data. Some of these sensors may be housed within protective enclosures. The enclosures may be inside specially controlled environments, such as refrigerators, freezers, and so forth. During operation of the facility, moisture may accumulate on these enclosures, impairing the ability of the camera to acquire an image through the window. Described are devices to selectively heat a viewable area of the window such that moisture accumulation is reduced with minimal power use.

Window heater system

A backlit device includes an outer layer, an adhesive layer, and a light guide configured to transmit light from a light source. The adhesive layer is positioned between the outer layer and the light guide. The outer layer includes a plurality of outer layer segments and at least one opening positioned between the outer layer segments where light from the light guide can pass through and provide backlighting. The adhesive layer includes a plurality of adhesive material segments. Each adhesive material segment is individually positioned between an outer layer segment and the light guide such that the perimeter of an outer layer segment surrounds the perimeter of the respective adhesive material segment. Through this arrangement, the adhesive material segments do not divert or block light passing through the opening in the outer layer.

Backlit illumination of electronics

Sensor window heating apparatus

Input device haptics and pressure sensing techniques are described. An input device includes an outer surface, a pressure sensor and haptic feedback mechanism, and a pressure sensing and haptic feedback module. The outer surface is configured to receive an application of pressure by an object. The pressure sensor and haptic feedback mechanism has one or more piezos configured to detect and quantify an amount of the application of the pressure to the outer surface by the object, the one or more piezos configured to output a signal indicating the quantified amount of the pressure. The pressure sensing and haptic feedback module is configured to receive the signal from the one or more piezos indicating the quantified amount of the pressure and control the haptic feedback of the pressure sensor and haptic feedback mechanism.

Input device haptics and pressure sensing

Techniques for a touch input in a circuit board are described. In at least some embodiments, a touch input device is integrated into a circuit board of an apparatus. For instance, a touch interaction region of the touch input device is formed by cutting and/or etching a portion of the circuit board such that the touch interaction region is moveable with respect to adjacent portions of the circuit board. According to one or more embodiments, a touch input device includes a switch such that movement of the touch interaction region actuates the switch to generate a click input event.

Touch input in a circuit board

Techniques for a touch input device in a circuit board are described. In at least some embodiments, a touch input device is integrated into a circuit board of an apparatus. For instance, a touch interaction region of the touch input device is formed by cutting and/or etching a portion of the circuit board such that the touch interaction region is moveable with respect to adjacent portions of the circuit board. According to one or more embodiments, a touch input device includes a switch such that movement of the touch interaction region actuates the switch to generate a click input event.

Touch input device in a circuit board

Techniques for fabric adhesion to an apparatus are described. According to one or more embodiments, an apparatus is laminated with fabric utilizing one or more fabric layers. In at least some embodiments, multiple adhesive zones are defined on a fabric layer. Each adhesive zone, for instance, has a particular set of properties, such as a particular location on a fabric layer, a particular adhesive thickness, a particular adhesive type, and so forth. In at least some embodiments, different adhesive zones differ from one another based on one or more of their respective properties and thus enable different fabric characteristics to be specified at different adhesive zones.

Fabric adhesion to an apparatus

Growing community of inventors

Redmond, WA, United States of America

John Jacob Nelson