Thermal Corporation

John J Todd, Jr

David Bruce Sarraf

Nelson J Gernert

James E Lindemuth

Robert E DeHoff

John Hartenstine

Brian E Mast

James L Smith, Jr

A heat pipe system including a heat transfer block and a heat pipe coupled to the heat transfer block by a clip. By utilizing a clip to couple the heat pipe to the heat transfer block, a higher degree of thermal coupling may be achieved, thereby allowing more heat to be transferred from the heat transfer block to the heat pipe. The heat pipe system has particular application in transferring heat away from heat-producing electronic components, such as computer chips.

Cooling system for electronics with improved thermal interface

A system for cooling a canister has first, second and third heat pipes. The first heat pipe has an evaporator and a condenser. The first heat pipe is mounted with its evaporator inside the canister and its condenser outside the canister. The second heat pipe has an evaporator conductively coupled to the condenser of the first heat pipe. The second heat pipe has a condenser. The third heat pipe has an evaporator conductively coupled to the condenser of the second heat pipe. The third heat pipe has a condenser with a plurality of fins on the condenser of the third heat pipe.

Heat pipe system for cooling flywheel energy storage systems

Growing community of inventors

Elizabethtown, PA, United States of America

John J Todd, Jr