International Business Machines Corporation

Other

John J Ritsko

George Frederick Walker

Sampath Purushothaman

Jungihl Kim

Kang-Wook Lee

Paul Alfred Lauro

Jane M Shaw

Stephen L Buchwalter

Shui-Chih Alan Lien

Gareth Geoffrey Hougham

Alfred Viehbeck

Terrence Robert O'Toole

Sung Kwon Kang

Tae Seok Oh

Eleftherios Adamopoulos

Rick A Hamilton, Ii

Clifford A Pickover

Keith E Fogel

Voya Rista Markovich

Vittorio R Castelli

Da-Yuan Shih

Fuad Elias Doany

Jerome J Cuomo

James L Speidell

Leathen Shi

Alessandro Cesare Callegari

Praveen Chaudhari

David Noel Light

Douglas Oliver Powell

James Patrick Doyle

James Andrew Lacey

Maurice Heathcote Norcott

Anthony P Ingraham

Peter M Fryer

Thomas P Gall

Jaynal Abedin Molla

Perminder S Bindra

Eileen Ann Galligan

Robert R Shaw

Mary Elizabeth Rothwell

James L Hedrick, Jr

George J Saxenmeyer, Jr

Jack A Varcoe

Joseph C Logue

Ekkehard F Miersch

David A Lewis

Christopher Vincent Jahnes

Paul Stephen Andry

Brian Samuel Beaman

Claudius Feger

Subhash Laxman Shinde

Jerry E Hurst, Jr

Peter Slota, Jr

Modest M Oprysko

Alina Deutsch

Steven E Molis

Richard Allen John

Kurt A Smith

James T Yeh

Randy William Snyder

Helen L Yeh

Walter P Pawlowski

John J Glenning

Laura Beth Rothman

Warren D Grobman

Yaffa Tomkiewicz

John R Lankard

Steven L Bard

Steven J Kirch

Brain S Beaman

Yuhichi Momoi

Fahfu Ho

Atilio Zupicich

A method for rendering a virtual world avatar of a computerized system is disclosed. The method comprises defining a plurality of receptor points located on the virtual world avatar, wherein the plurality of receptor points is associated with at least one object that moves between the plurality of receptor points based upon at least one predetermined trigger, changing a state of at least one of the plurality of receptor points from a first state to a second state based upon a measurable quantity and a predetermined threshold to update the associated at least one object, and in response to the measurable quantity no longer satisfying the predetermined threshold, reverting the state of the at least one of the plurality of receptor points from the second state back to the first state.

System and method for enabling multiple-state avatars

A method of rendering an electronic graphical representation of a user of a computerized system includes providing a plurality of states for the electronic graphical representation including first and second differing states, monitoring a measurable quantity to provide a monitored quantity, and changing a state of the graphical representation from the first state to the second state based upon the monitored quantity. The graphical representation is an avatar and the method includes defining a receptor point associated with the avatar and associating an object with the receptor point. The receptor point is located on the avatar. The plurality of states includes a non-hybrid state. The plurality of states includes a hybrid state. The hybrid state is a static image hybrid state and a video hybrid state. The video hybrid state is a live video hybrid state and a pre-recorded video hybrid state.

New etch barriers of indium-tin-oxide in the manufacturing process of thin film transistor-liquid crystal display are self-assembled monolayers, such as n-alkylsilanes. A typical process of applying a self-assembled monolayer is to ink a hydrolyzed n-octadecyltrimethoxysilane solution on to a stamp and then to transfer the solution onto ITO. The surface of the stamp may be polar enough to be wet with polar self-assembled monolayer solutions of an akylsilane. A non-polar stamp surface may be treated with oxygen plasma to obtain a wettable polar surface.

Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displays

A liquid crystal display cell having liquid crystal molecules positioned in a vertical or a substantially vertical alignment is provided. The liquid crystal display cell includes at least two substantially homogeneous fluorinated alignment layers disposed on transparent electrodes; a liquid crystal layer of liquid crystal molecules disposed between the alignment layers; and, a means of applying voltage across the transparent electrodes. Methods for forming these liquid crystal display cells are also provided.

Liquid crystal display cell having liquid crystal molecules in vertical or substantially vertical alignment

It is important to accurately align a pair of substrates, such as liquid crystal display (LCD) panels before they are affixed together. This is accomplished, according to the invention, by depositing a number of magnetic field generating elements on one substrate and a plurality of magnetic field-detecting elements on the other substrate. For example, the field-generating elements can be permanent magnets, while the field-detecting can be correspondingly located elements of a magnetic material. Alternatively, both the field-generating and field-detecting elements may be made from permanently magnetic materials.

Self alignment of substrates by magnetic alignment

A system for aligning two plates, in accordance with the present invention, includes a first plate having a lithographically patterned structure formed on a first surface. A second plate also has a lithographically patterned structure formed on a second surface, the first and second surfaces being disposed to face each other. The patterned structures of the plates have corresponding and opposing edges to provide an interference fit between the patterned structures of the first and second plates wherein self-alignment between the first and second plates is realized by engaging the corresponding and opposing edges in the interference fit. A method for aligning two plates includes the steps of providing the system described above, coarsely aligning the plates in a first state which includes an interference between the patterned structures, adjusting at least one of plates to provide a second state having a clearance fit between the patterned structures and moving the plates together and returning to the first state to align the plates relative to each other.

Precision alignment of plates

The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate. A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.

Adhesive layer in multi-level packaging and organic material as a metal

The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate. In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation. A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.

The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is formed from a substrate having disposed on at least one surface a plurality of electronic devices. Each assembly is disposed in a stack of adjacent assemblies. Between adjacent assemblies there is an electrical interconnection means electrically interconnecting each assembly. The electrical interconnection means is formed from an elastomeric interposer. The elastomeric interposer is formed from an elastomeric material having a plurality of electrical conductors extending therethrough, either in a clustered or un-clustered arrangement. The electrical interconnection means is fabricated having a plurality of apertures extending therethrough. The array of apertures corresponds to the array of electronic devices on the substrates. The aperture and electrical interconnection means is disposed over the array of electronic devices so that the electrical interconnection means is between adjacent electronic devices. The stack of assemblies is compressed thereby compressing the electrical interconnection means between adjacent assemblies. The substrate or each assembly is formed from a thermally conductive material such as diamond. A heat dissipation means is thermally connected to the edges of the substrate to extract heat generated within the structure. Methods for fabricating the electrical interconnection means as a stand alone elastomeric sheet are described. The ends of the plurality of conductors in the electrical interconnection means are fabricated so that upon compression between adjacent assemblies there is a wiping action between the conductor ends and contact locations on the adjacent assemblies to form a good electrical contact therewith.

Method of forming a three dimensional high performance interconnection

The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is formed from a substrate having disposed on at least one surface a plurality of electronic devices. Each assembly is disposed in a stack of adjacent assemblies. Between adjacent assemblies there is an electrical interconnection electrically interconnecting each assembly. The electrical interconnection formed from an elastomeric interposer having a plurality of apertures extending therethrough. The array of apertures corresponds to the array of electronic devices on the substrates. The aperture and electrical interconnection is disposed over the array of electronic devices so that the electrical interconnection between adjacent electronic devices. The stack of assemblies is compressed thereby compressing the electrical interconnection between adjacent assemblies. Methods for fabricating the electrical interconnection as a stand alone elastomeric sheet are described.

Three dimensional high performance interconnection package

Methods of fabricating powders of metal particles containing grain growth control additives are described. A powder, metal particles, e.g., copper particles, are mixed with a powder of additive particles, e.g., alumina particles. The mixture is milled in a high energy ball mill to provide metal particles having substantially uniformly distributed therein of additive particles. The ball milled powder contains elongated high aspect ratio particles. The high aspect ratio particles are reduced in size by jet impact milling. The jet impact milled powder can be used to form a conductor forming paste in the fabrication of a metallized ceramic substrate for semiconductor chip packaging application. The jet impact milled powder has particles of sufficiently small in size to fill vias between metallization layers in the green ceramic precursor to the ceramic substrate. During sintering of the combination of ceramic precursor and conductor forming paste, the grain growth control additive results in a substantially void free via filled with metal having a fine grain morphology.

Method for producing metal powder with a uniform distribution of

A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. Pulse electroplating of palladium provides a dendritic deposit of uniform height, uniform rounded points and less branching. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.

Method of fabricating nendritic materials

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Mount Kisco, NY, United States of America

John J Ritsko