International Business Machines Corporation

John J Liutkus

Alphonso Philip Lanzetta

Linda C Matthew

Ho-Ming Tong

Claudius Feger

Michael J Palmer

Teresita Ordonez Graham

Kurt R Grebe

Charles H Wilson

Helen L Yeh

Nelson R Tanner

Paul William Coteus

Lawrence Shungwei Mok

Jane M Shaw

Thomas Mario Cipolla

Michael Hatzakis

Caroline A Kovac

Christina M Knoedler

Brian C Derdall

Irene A Sterian

Jurij R Paraszcszak

A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by application of special coatings to lead areas of the flex tape.

Coated means for connecting a chip and a card

Method of applying flex tape protective coating onto a flex product

The present invention relates to an improved flex (or TAB) product suitable for silicon carrier or other types of chip carrier applications, wherein the flex reliability problems caused for example by Cu thermal cycling are substantially reduced or eliminated. More particularly, the invention embodies a number of coatings for use in such products and diverse methods of making and using same.

Flex tape protective coating

A high density circuit package includes a pair of planar packages, the planar packages exhibiting front and back surfaces and positioned back-to-back in the high density circuit package. Each planar package includes a flexible circuit carrier having a plurality of circuit chips mounted thereon. Front and back planar metallic heat sinks sandwich the circuit carriers, at least one of the heat sinks contacting a surface of the chips mounted on the sandwiched circuit carriers. Each heat sink is provided with air flow apertures formed in its planar surface and adjacent to each circuit chip. A circuit card interconnects with the circuit carriers in an interconnection region and is pluggable into a female connector. The planar metallic heat sinks and circuit carriers are mechanically packaged so as to provide a planar arrangement which aligns the apertures in both the front and rear heat sinks. A pair of planar packages are mechanically connected in a back-to-back arrangement so that the apertures therebetween are aligned. The associated circuit cards are also back-to-back oriented so as to enable their joint interconnection into the female connector.

High density, high performance memory circuit package

A cement composition containing cement, water, and a silanol terminated polysiloxane, and cured products thereof exhibiting improved thermal stability and dielectric constant.

Polysiloxane modified cement

Poly(halogenated styrene) compositions having a molecular weight range of from about 1.times.10.sup.5 to 1.times.10.sup.6 and a dispersivity of from about 1.5 to about 2.5 useful as negative resists.

Halogenated polystyrenes for electron beam, X-ray and photo resists

Growing community of inventors

Yorktown Heights, NY, United States of America

John J Liutkus