Other

Seminex Corporation

Cufer Asset Ltd. L.l.c.

Cufer Assett Ltd. L.l.c.

John J Callahan

John A Trezza

Gregory Dudoff

David M Bean

Kevin J Kelly

Richard N Hyland

Christopher R Rafferty

A system for self-aligning assembly and packaging of semiconductor lasers allows reduction of time, cost and testing expenses for high power density systems. A laser package mounting system, such as a modified TO-can (transistor outline can), has modifications that increase heat transfer from the active laser to a heat exchanger or other heat sink. A prefabricated heat exchanger assembly mounts both a laser package and one or more lenses. Direct mounting of a fan assembly to the package further minimizes assembly steps. Components may be physically and optically aligned during assembly by clocking and other indexing means, so that the entire system is self-aligned and focused by the assembly process without requiting post-assembly adjustment. This system can lower costs and thereby enable the use of high powered semiconductor lasers in low cost, high volume production, such as consumer items.

Semiconductor laser assembly and packaging system

A system for self-aligning assembly and packaging of semiconductor lasers allows reduction of time, cost and testing expenses for high power density systems. A laser package mounting system, such as a modified TO-can (transistor outline can), has modifications that increase heat transfer from the active laser to a heat exchanger or other heat sink. A prefabricated heat exchanger assembly mounts both a laser package and one or more lenses. Direct mounting of a fan assembly to the package further minimizes assembly steps. Components may be physically and optically aligned during assembly by clocking and other indexing means, so that the entire system is self-aligned and focused by the assembly process without requiring post-assembly adjustment. This system can lower costs and thereby enable the use of high powered semiconductor lasers in low cost, high volume production, such as consumer items.

An electrical connection between two chips includes an IC pad on a first chip, an IC pad on a second chip, a first barrier metal over the IC pad of the first chip, a second barrier metal over the IC pad of the second chip, a malleable electrically conductive metal, different from the barrier metals, trapped between the first barrier metal and the second barrier metal, the first barrier metal, the malleable conductive metal and the second barrier metal forming a complete electrically conductive path between the IC pad of the first chip and the IC pad of the second chip.

Contact-based encapsulation

A semiconductor chip, having IC pads, the semiconductor chip having a device, electrically connected to at least one electrical contact through the IC pad, the electrical contact having a height and a cross sectional profile, through the height, configured to facilitate penetration of at least a portion of the electrical contact into a malleable contact on a second semiconductor chip.

Profiled contact

Handheld laser device

A chip having at least one electrical contact having a first end proximate to the chip and a second end removed from the chip, the second end including a pattern configured to facilitate penetration of the at least one contact into a malleable contact on another chip, the pattern comprising a non-planar surface having a perimeter and a surface area, the surface area being larger than a planar surface of an identical perimeter.

Patterned contact

A method of electrically joining a first contact on a first wafer with a second contact on a second wafer, the first contact, a rigid material, and the second contact, a material that is malleable relative to the rigid material, such that when brought together the rigid material will penetrate the malleable material, the rigid and malleable materials both being electrically conductive involves bringing the rigid material into contact with the malleable material, applying a force to one of the first contact or the second contact so as to cause the rigid material to penetrate the malleable material, heating the rigid and malleable material so as to cause the malleable material to soften, and constraining the malleable material to within a pre-specified area.

Chip connector

A chip contact functionally having an IC pad, a barrier layer over the IC pad, and a malleable material over the barrier layer. An alternative chip contact functionally having an IC pad, a barrier layer over the IC pad, and a rigid material over the barrier layer.

Electronic chip contact structure

A method of physically and electrically joining two chips to each other involves aligning an electrically conductive contact of a first chip with a corresponding electrically conductive contact on a second chip, the electrically conductive contact of the first chip being a rigid material and the electrically conductive contact of the second chip being a material that is malleable, bringing the aligned electrically conductive contact of the first chip into contact with the corresponding electrically conductive contact on the second chip, elevating the contact of the chips to a temperature that is below a liquidus temperature for both the rigid material and the material that is malleable while applying pressure to the chips so as to cause the rigid material to penetrate the malleable material and form an electrically conductive connection, and, following the forming of the electrically conductive connection, cooling the contacts to an ambient temperature.

Post & penetration interconnection

A method involves pattern etching a photoresist that is located on a wafer that contains a deposited seed layer to expose portions of the seed layer, plating the wafer so that plating metal builds up on only the exposed seed layer until the plating metal has reached an elevation above the seed layer that is at least equal to a thickness of the seed layer, removing the solid photoresist, and removing seed layer exposed by removal of the photoresist and plated metal until all of the exposed seed layer has been removed.

Post-seed deposition process

A process, and associated apparatus, that separates the economic components of scrapped rubber tires while isolating and removing certain levels of contamination associated with these tires. The separation of the scrap tires contaminants is accomplished by shredding, washing, and rasping the tire product. The continual laboratory testing of the waste wash water and removal of the contaminates and particulates will produce an end-product of 3 to 100 mesh/crumb which will be virtually without contamination. The quality of the end-product is further enhanced by the associated quality apparatus that removes the steel and fiber products in addition to any contaminants.

Growing community of inventors

Wilmington, MA, United States of America

John J Callahan