Westinghouse Electric Corporation

United States of America As Represented by the Secretary of the Air Force

John J Buckley

James A Rew

Corey H Bowcutt

Frank E Altoz

Michael J Ankrom

Dale R Logan

William T Scott

A method for vapor phase soldering components onto a PWB onto which solder has been previously deposited includes the steps of applying a fluxing agent on the PWB and introducing the PWB into a vapor phase environment. The application of flux is a multi-step process which includes a sequential application of flux to the PWB. The vapor phase environment defines a temperature gradient between approximately ambient and the temperature of a saturated vapor of a first selected fluid which defines a primary saturated vapor phase with a boiling point which is greater than the melting point of solder. A second fluid having a boiling point which is lower than the first fluid is utilized to generate a secondary vapor blanket in order to prevent excessive loss of the fluid defining the primary vapor phase. The PWB is heated according to a controlled process in which the temperature of the PWB is continuously monitored.

Method for vapor phase soldering

An apparatus for printed wiring board assembly provides for the populating with components of a printed wiring board having at least one adjacent pair of pad rows onto which solder has been deposited. A curable adhesive strip is applied between the adjacent pair of pad rows. The adhesive strip has a first adhesive side which adheres to the printed wiring board and an opposed, second adhesive side onto which the components are selectively mounted so that the component's leads are aligned with the pad rows. A predetermined constant force is applied to the components and the adhesive strip is cured. The apparatus supports the printed wiring board and maintains a predetermined constant force on the components. A frame defining a generally U-shaped member has an upper and a lower surface. The U-shaped member has a slot therein for receiving the printed wiring board therein. An upper and a lower cover member are removably secured to the U-shaped member to generally enclose the printed wiring board. Resilient biasing is disposed between the printed wiring board and the cover members, whereby a predetermined constant force is maintained on the mounted components.

Apparatus for printed wiring board component assembly

A direct air cooling system 12 for electronics carried by aircraft. The cooling system provides a submerged air scoop 16 which directs outside air to several electronic modules 14. The air flows through passages 76 in the modules 14 which are adjacent to circuit boards 74, 78 bearing discrete electronic components 88. A foil layer 86 and aluminum fin stock help transfer heat from the electronic components to the directed air. Heated air is then exhausted through exhaust port 24 or 28.

Direct air cooling system for airborne electronics

A modular air shut-off valve, particularly useful within the air conditioning environmental control system of an aircraft, is provided, which comprises a housing sized for insertion into a duct of the air conditioning system, a vane pivotally mounted within the housing for pivotal movement between open and closed positions and having flexible portions along its edges contacting the housing in the closed position for providing a resilient seal and to allow pressure relief in the event of overpressure within the duct.

Modular air shut-off valve

A two axis gimbal set for a pod mounted electro-optical system wherein the azimuth gimbal is supported by the elevation gimbal which in turn is supported between a pair of spaced supporting arms of a base by bearings, one of which has a circular opening therein through which the line-of-sight travels from the optical system to a movable mirror. An inertial dampener is attached to the mirror shaft for reducing effects of vibration on the line-of-sight.

Growing community of inventors

Baltimore, MD, United States of America

John J Buckley