Elco Corporation

John J Ashman

Frank C Youngfleish

Roger W Byczek

Randy Hendrich

A removable memory device includes a substrate, such as a printed circuit board, carrying IC memory packages; a connector including a molded plastic connector block for electrically connecting the removable memory device to a host system; and a sheet metal cover for enclosing the substrate. The cover has opposed forward edges including a plurality of forwardly projecting retention tabs received within a plurality of corresponding retention slots formed in the upper and lower outer surfaces of the connector block. The slots and tabs are preferably directed inwardly to provide a secure latched connection between the cover and connector.

Latch mechanism for joining the cover and connector of a removable

A pad array socket for use in mechanically and electrically connecting a high density pad array integrated circuit carrier to a printed circuit substrate. The socket comprises a flexible circuit, a molded elastomeric spring member, a frame, and a cover. The frame defines a cavity. The elastomeric spring member is placed at the bottom of the cavity. The flexible circuit is placed directly over the elastomeric spring member. An integrated circuit carrier is placed into the cavity upon the flexible circuit. The cover is then secured over the assembly, thereby applying downward pressure on the integrated circuit carrier. The spring member applies upward pressure to the flexible circuit, thereby causing the electrical contacts of the flexible circuit to come into contact with the electrical contacts of the integrated circuit carrier. The flexible circuit includes leads that extend from the socket and which may be soldered to the substrate, thereby mechanically securing the socket to the substrate and providing electrical contact between the socket and the substrate.

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Huntingdon, PA, United States of America

John J Ashman