Hewlett-packard Development Company, L.P.

Other

John Hua

Anisha Anand

Orville H Orr

Gordon J Chambers

Patrick A Raymond

Richard Barnett

David G Carpenter

Jaime E Llinas

A system () and method () are disclosed for detecting electrical connectivity. The system includes at least one power distribution conductor () and at least one electrical power pad () comprising a detection pad () that is electrically isolated from a remaining portion of the respective at least one electrical power pad (). A measured parameter at the detection pad () provides an indication of electrical connectivity between the at least one power distribution conductor () and the respective at least one electrical power pad ().

Systems and methods for determining electrical connectivity

A system () and method () are disclosed for detecting electrical connectivity. The system includes at least one power distribution conductor () and at least one electrical power pad () comprising a detection pad () that is electrically isolated from a remaining portion of the respective at least one electrical power pad (). A measured parameter at the detection pad () provides an indication of electrical connectivity between the at least one power distribution conductor () and the respective at feast one electrical power pad ().

The present disclosure provides a circuit board with a first via and a second via, the first and second vias providing an electrical path from a top surface of the circuit board to a bottom surface of the circuit board. The circuit board also includes a first contact pad electrically coupled to the first via and a second contact pad electrically coupled to the second via. The first contact pad is disposed at an angle with respect to a reference line crossing through the center of the first and second vias, and the second contact pad is disposed on an opposite side of the reference line at the angle with respect to the reference line, such that a footprint that encompasses an area between the first and second contact pads does not cover the first and second vias.

Circuit board contact pads

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Houston, TX, United States of America

John Hua