Qualcomm Incorporated

Other

Honda Motor Co., Ltd.

John Holmes

Xia Li

Robert A Frosch

Bin Yang

Aniket Patil

Kuiwon Kang

Yangyang Sun

David Fraser Rae

Dongming He

Marcus Hsu

William Michael Stone

Christopher Healy

Kenneth E Mayo

Charles R Fink

Sun Yun

Avantika Sodhi

Norman Van Dine

Xuefeng Zhang

Ronald T Miles

Michael James Solimando

Rajendra Pendse

Substrate with multiple core layers to provide varied thickness cavities supporting varied thickness embedded electrical devices, and related integrated circuit (IC) packages and fabrication methods. To provide for core layer of the substrate to support multiple embedded electrical devices, multiple core layers are provided in the substrate. Providing multiple core layers in the substrate allows multiple cavities to be formed in the core layers at multiple depths to compatibly support embedding of multiple electrical devices of varied thicknesses in the core layers. Thus, providing multiple core layers in the substrate can compatibly support forming cavities of multiple thicknesses that are compatible with multiple electrical devices of different thicknesses to be embedded therein. In this manner, design parameters of the overall thickness of the core layer of a substrate can be independent of the variation in thicknesses of multiple embedded electrical devices desired to be embedded therein.

Substrate with multiple core layers to provide varied thickness cavities supporting varied thickness embedded electrical devices, and related integrated circuit (IC) packages and fabrication methods

A vehicle-grid integration management system determines use of a power grid by an electric vehicle in a dual multi-part rate structure including a grid account portion associated with a relationship between the electric vehicle and the power grid, a group account portion associated with a relationship between the vehicle group and the electric vehicle and/or the power grid, a consumption portion associated with a volume of electricity drawn from the power grid by the electric vehicle over a time period, a supply portion associated with a volume of electricity delivered to the power grid by the electric vehicle over the time period, a demand portion associated with an upper threshold of electricity drawn from the power grid by the electric vehicle over the time period, and a capacity portion associated with an upper threshold of electricity delivered to the power grid by the electric vehicle over the time period.

Methods and systems for managing vehicle-grid integration

Disclosed are devices, fabrication methods and design rules for flip-chip devices. Aspects include an apparatus including a flip-chip device. The flip-chip device including a die having a plurality of under bump metallizations (UBMs). A package substrate having a plurality of bond pads is also included. A plurality of solder joints coupling the die to the package substrate. The plurality of solder joints are formed from a plurality of solder bumps plated on the plurality of UBMs, where the plurality of solder bumps are directly connected to the plurality of bond pads.

Flip-chip device

A package that includes a first substrate, an integrated device coupled to the first substrate, a second substrate coupled to the integrated device, and an encapsulation layer located between the first substrate and the second substrate. The second substrate is configured to operate as a heat spreader. The second substrate is configured to be free of an electrical connection with the integrated device.

Package comprising a substrate configured as a heat spreader

A package on package (PoP) device includes a first package, a thermal interface material, and a second package coupled to the first package. The first package includes a first integrated device and a first encapsulation layer that at least partially encapsulates the first integrated device, where the first encapsulation layer includes a first cavity located laterally with respect to the first integrated device. The thermal interface material (TIM) is coupled to the first integrated device such that the thermal interface material (TIM) is formed between the first integrated device and the second package. The thermal interface material (TIM) is formed in the first cavity of the first encapsulation layer.

Package on package (PoP) device comprising thermal interface material (TIM) in cavity of an encapsulation layer

An oceanic wave measurement system wherein wave height is sensed by a barometer mounted on a buoy. The distance between the trough and crest of a wave is monitored by sequentially detecting positive and negative peaks of the output of the barometer and by combining (adding) each set of two successive half cycle peaks. The timing of this measurement is achieved by detecting the period of a half cycle of wave motion.

Oceanic wave measurement system

A buoyant body stabilized against both roll and heave is described in which the hull has a generally spherical surface and in which the weight of the hull and its contents is of such magnitude and is distributed so that the body floats with a predetermined portion up and so that the natural periods of both roll and heave oscillations are greater than the periods of any waves of significant height reasonably expected to be encountered in the waters where the body is deployed. Also described is the use of the body as a self-propelled off shore oil terminal into which a super tanker can discharge its entire load while remaining in deep, traffic free water.

Roll and heave stabilized buoyant body

Growing community of inventors

San Diego, CA, United States of America

John Holmes