International Business Machines Corporation

Jds Uniphase Corporation

John Henry Sherman

Benson Chan

Richard Ronald Hall

Paul Francis Fortier

How Tzu Lin

Glen Walden Johnson

Glenn Edward Myrto

William Louis Brodsky

Francois Guindon

Paul Andrew Wormsbecher

Walter Adrian Goodman

Glenn L Kehley

Charles R Hatton

Gerald Daniel Malagrino, Jr

James Robert Moon

Ladd William Freitag

Real Joseph Tetreault

Martial A Letourneau

David J Podmajersky

Frank V Grebe

Joseph Paul Kuczynski

Gary T Galli

Kishor V Desai

Mitchell S Cohen

David R Motschman

Christopher John Majka

Candido C Tiberia

George T Brown

Julian Dominick Rizzi

Edward Richard Ritinski

James Earl Olson

Dennis P Reynolds

David R Hermansen

Vincent M Coppola

An optical coupler arrangement which is employed for replicating surface features of diverse types of optical devices. Also disclosed is to a novel method of accurately replicating surface features of optical devices; particularly through the utilization of the novel optical coupler arrangement.

Optical coupler replication arrangement and process

A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.

Assembly of opto-electronic module with improved heat sink

A method and structure to establish and maintain an electrical connection between electrical contacts. A bladder is placed within a fixture and pressurized. The pressurized bladder applies a force that will establish and maintain an electrical connection between a first contact pad and a second contact pad.

Pressurized electrical contact system

Optical packages and a method of fabricating same, wherein an active optical device can be located relative to a substrate and coupler. The structure includes a substrate having electrical contact pads and alignment pads with precision aligned through-holes for at least one optical fiber. The optical fibers are supported by a housing, or coupler, having alignment pins that are precision located relative to the through-holes in the substrate and the optical fiber. A die, or active optical device, with one or more active optical elements on a first die surface and electrical contacts on a second die surface, is aligned with the electrical pads of the substrate and the active optical elements. The method incorporates the steps of grinding alignment pins into metallic pads and grinding optical fibers in one pass and then aligning the active optical device and the optical fibers by using the surface tension of conductive adhesive liquid. The fibers are then bonded.

Optical device with chip level precision alignment

A package is described that couples a twelve channel wide fiber optic cable to a twelve channel Vertical Cavity Surface Emitting Laser (VCSEL) transmitter and a multiple channel Perpendicularly Aligned Integrated Die (PAID) receiver. The package allows for reduction in the height of the assembly package by vertically orienting certain dies parallel to the fiber optic cable and horizontally orienting certain other dies. The assembly allows the vertically oriented optoelectronic dies to be perpendicularly attached to the horizontally oriented laminate via a flexible circuit.

Fiber optic connections and method for using same

An optical coupler includes a first plate and a second plate superposed over the first plate. At least the second plate has at least one groove formed therein. The at least one groove extends continuously from one edge of the second plate to another edge of the second plate. An optical fiber is disposed in the at least one groove.

Enhanced optical coupler

An optical transceiver arrangement includes a retainer assembly. The retainer assembly includes at least one housing adapted to be coupled to a fiber optic cable, and at least one carrier assembly having a carrier, and a die chip attached to the carrier. The die chip has at least one active region. The optical transceiver arrangement further includes at least one optical coupler disposed within the housing for optically coupling the at least one active region to the fiber optic cable. The optical transceiver arrangement also includes a laminate assembly having the retainer assembly disposed thereon. The die chip is electrically coupled to the laminate assembly.

Enhanced optical transceiver arrangement

The present invention relates generally to fiber optical arrays, and particularly, but not by way of limitation, to 3-dimentional array fiber optical couplers. More particularly, the present invention provides means of coupling semiconductor laser light sources to fiber-optic transmission devices.

Stacked optical coupler

An optical coupler that provides for the direct mounting of integrated circuit(s). The coupler includes a two-part housing with grooves for accommodating optical fibers that are held in place when the two parts are put together. Circuitry is formed on the housing and solder balls, when heated to a liquid state and cooled (reflowed), are used to attach integrated circuit(s) onto the housing. At least one of these integrated circuit(s) is an optical die that is positioned in close proximity to the optical fibers to provide for the receipt and/or transmission of optical signals. The reflowing of the solder balls forms an electrical connection between the circuitry on the housing and the integrated circuit(s) and provides for alignment of these components. The housing is attached to a circuitized substrate using reflowed solder balls or wirebonds.

Multi-functional fiber optic coupler

Alignment systems for optoelectronic modules with overmolded chip carriers include drilled or milled substrate corners for engaging dowel pins to precisely align the substrate in a mold for molding an overmold frame on the substrate. The overmold frame includes slot and trilobe holes for receiving retainer posts to precisely align a retainer assembly on the overmold frame. Cooperating standoff pads on the overmold frame and on the retainer assembly stabilize the assembly of these components and provide a precise gap for receiving an adhesive to permanently attach these two components. The retainer assembly carries optoelectronic components that include a flexible circuit, and a distal end portion of this flexible circuit and walls of a receiving cavity in the overmold frame have cooperating features for precisely aligning distal electrical leads of the flexible circuit with an array of electrical pads on the substrate. A permanent shroud on a proximate end portion of the flexible circuit protects and helps align proximate electrical leads with electrical pads on optic dies and their carriers.

Alignment systems for subassemblies of overmolded optoelectronic modules

An optical fiber guide includes a matrix of holes integrated directly into a substrate on which one or more optical chips are mounted. The substrate therefore functions both as a guide for optically coupling a plurality of optical fibers to an optical chip, as well as a carrier for the optical chip itself. The size of the fiber guide and its integration density is therefore improved over conventional fiber connectors. The substrate is preferably made of a material having a coefficient of thermal expansion substantially similar to the coefficient of thermal expansion of the optical chip. This ensures that the optical fibers will remain optically coupled to the chip through the matrix of holes in the substrate regardless of external temperature influences. If desired, integrated circuits may be mounted onto the substrate to increase the functionality of the fiber guide. A method for making the fiber guide has fewer process steps than conventional methods because fiber guide has fewer parts than conventional fiber-optic connectors.

Optical fiber guide module and a method for making the same

A plug which has a plugging portion and a stem extending therefrom is formed of an elastomeric material in order to deform to create a wiping engagement and a seal with the walls of a receiving cavity. The stem and plugging portion include both cavities for receiving alignment pins in the device being plugged and a manually engageable portion on a distal end of the stem for removing the plug from the sealed cavity, such as within an optical subassembly module. The side edges of the plugging member conform to the cavity cross-section to enhance the sealing yet do not unduly deform the member. The sealing member is formed with one or more standoffs to engage an end face of the cavity, assuring no contact between the optical elements and the plug. The edges of the plug deform upon insertion to create the seal and form a wiping engagement with the cavity interior.

Processing protective plug insert for optical modules

A heat sink for a transceiver optoelectronic module including dual direct heat paths and structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.

An electronic package contains a circuit card to which a chip carrier plate is attached via solder balls. A heat spreader plate, supporting a heat sink, is spring loaded against the semiconductor chip of the carrier plate by means of elastomeric disks disposed upon a spring retainer plate that is, itself, disposed adjacent the chip carrier plate. A plastic cover both protects and supports the heat sink and semiconductor chip. A retention latch is disposed between the cover plate and the spring retainer plate.

Electronic chip packaging

An interposer for connecting two circuit members. The interposer has two extending conductive ends, is &ldquo;Z&rdquo; shaped, and has a center of gravity positioned relative to one of the conductive ends such that the interposer is capable of standing upright upon that end without external support. The interposer may be composed of a plated metal, and at least one of the extending conductive ends may have deposited dendrites or a raised bump. The Z-shaped interposer prevents bowing or cracking of the connected structure which otherwise occurs during use due to the different thermal coefficients of expansion of the two circuit members.

Growing community of inventors

Lisle, NY, United States of America

John Henry Sherman