Advanced Cooling Technologies, Inc.

Thermal Corporation

Aavid Thermal Corp.

John Hartenstine

David Bruce Sarraf

William G Anderson

Scott D Garner

Jerome E Toth

Peter M Dussinger

Robert E DeHoff

Calin Tarau

Christopher J Peters

John J Todd, Jr

Kyle S Van Riper

Michael J DeChristopher

Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.

CTE-matched heat pipe

A heat pipe with a capillary structure that consists of heat conductive capillary grooves in the condenser region that meet with a porous wick in the evaporator section. The embodiments include several structures of the interface at the junction of the porous wick and the capillary grooves. One such interface is a simple butt joint. Others have interlocking shapes on the wick and the grooves such as parts of the wick that fit into or around the grooves.

Hybrid heat pipe

An evaporator for a loop heat pipe with high input heat transfer. The heat transfer is attained by constructing a heat pipe on the loop heat pipe evaporator heat input surface. The heat pipe then distributes the heat from limited input areas over the entire surface of the loop heat pipe evaporator, and that entire evaporator surface functions as the loop heat pipe heat input area as opposed to limited smaller areas into which the heat usually enters.

Loop heat pipe evaporator including a second heat pipe

The apparatus is a capillary loop evaporator in which the vapor space is the internal volume of a cup shaped evaporator wick with sidewalls in full contact with the outer casing of the evaporator. Liquid is furnished to the wick through thicker wick wall sections, slabs protruding from the liquid-vapor barrier wick, eccentric wick cross sections, or tunnel arteries. The tunnel arteries can also be formed within heat flow reducing ridges protruding into the vapor space. The tunnel arteries can be fed liquid by bayonet tubes or cable arteries, and can be isolated from the heat source with regions of finer wick to impede vapor flow into the liquid. Tunnel arteries also enable separation of the evaporator and the reservoir for thermal isolation and structural flexibility. A wick within the reservoir aids collection of liquid in low gravity applications.

Evaporator for capillary loop

A heat pipe system including a heat transfer block and a heat pipe coupled to the heat transfer block by a clip. By utilizing a clip to couple the heat pipe to the heat transfer block, a higher degree of thermal coupling may be achieved, thereby allowing more heat to be transferred from the heat transfer block to the heat pipe. The heat pipe system has particular application in transferring heat away from heat-producing electronic components, such as computer chips.

Cooling system for electronics with improved thermal interface

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Mountville, PA, United States of America

John Hartenstine