General Electric Company

The United States of America As Represented by the United States

Martin Marietta Corporation

John H Lupinski

Erik W Walles

James V Crivello

Herbert S Cole

Patricia Chapman Irwin

Robert Edgar Colborn

John E Hallgren

Bernard Gorowitz

Donald A Bolon

Michael G Minnick

Mark Markovitz

Michael John Davis

Victoria J Eddy

James R Presley

Steven J Kubisen, Jr

Thomas Bert Gorczyca

Martin A Byrne

James M McQuade

Wilson J Barnes

Robert J Wojnarowski

Steven Thomas Rice

Christopher M Hawkins

Paul Edward Howson

Edith M Boldebuck

Theresa Ann Sitnik-Nieters

Theresa A Sitnik

Polyetherimide compositions are provided having condensed bis (4-aminophenyl) sulfone units, diaminophenylindane units or a mixture thereof. These polyetherimides compositions have been found useful for making high temperature chip adhesives, laminating adhesives and film adhesives for high density interconnects in electronic circuitry.

High temperature polyether imide compositions and method for making

A multichip module (incorporating a high density interconnect structure) has: a first portion containing a substrate with semiconductor chips therein, with each chip having contact pads; a second portion comprising a (HDI) structure interconnecting the chip pads; and a solvent-soluble release layer bonding the two portions together and allowing for easy removal of the HDI structure from the substrate of the module by immersion in an appropriate solvent for the release layer.

Reworkable high density interconnect structure incorporating a release

Polyimides useful in electronic applications are prepared by the reaction of at least one aromatic tetracarboxylic acid or functional derivative thereof with at least one diamine in benzonitrile solution. The preferred tetracarboxylic acid derivative and diamine are 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride and bis(4-aminophenyl) sulfone, respectively. A second organic liquid, such as toluene, which is miscible with and has a lower boiling point than benzonitrile and which preferably forms an azeotropic mixture with water, is preferably also present.

Method for preparing polyimides for use in electronic applications

A plasticized polyetherimide, such as a blend of polyetherimide and a pentaerythritol tetrabenzoate ester, has been found useful as a low temperature laminating adhesive for making high density interconnect circuit arrays.

Plasticized polyetherimide adhesive composition and usage

Flame retardant polyphenylene ether compositions are provided which utilize a silicone fluid treated filler, such as a clay or fumed titanium oxide treated with a polydiorganosiloxane fluid.

Flame retardant polyphenylene ether compositions

Heat curable dielectric compositions are provided comprising blends of silicone polyimide and epoxy resin and an effective amount of an arylonium salt such as a diaryliodoniumhexafluoroantimonate in combination with a free radical generating aromatic compound as a cocatalyst.

Heat curable blends of silicone polymide and epoxy resin

The incorporation of silicone treated filler selected from carbon black, titanium dioxide or clay into polycarbonates or polyester carbonates has been found to provide polycarbonate compositions having improved flame retardant properties.

Flame retardant polycarbonate compositions

Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.

Fibers impregnated with epoxy resin mixture, brominated bisphenol and

A method for encapsulating microelectronic devices is provided using a heat curable epoxy composition having a monomeric or polymeric diaryliodonium hexafluoroantimonate salt. Curable compositions are also provided as well as encapsulated microelectronic devices.

Microencapsulation method, microelectronic devices made therefrom, and

A heat curable composition is provided which is useful for encapsulating microelectronic devices using a heat curable epoxy composition having a diaryliodonium hexafluoroantimonate salt as a catalyst in combination with an effective amount of a free radical generating aromatic compound as a cocatalyst.

Encapsulation method, microelectronic devices made therefrom, and heat

Printed circuit board from fibers impregnated with epoxy resin mixture,

Curable polyphenylene ether-polyepoxide compositions useful in printed

Method of encapsulating electronic devices

An improved amorphous metal composite and process of making the composite. The amorphous metal composite comprises amorphous metal (e.g. iron) and a low molecular weight thermosetting polymer binder. The process comprises placing an amorphous metal in particulate form and a thermosetting polymer binder powder into a container, mixing these materials, and applying heat and pressure to convert the mixture into an amorphous metal composite.

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Scotia, NY, United States of America

John H Lupinski