Motorola Corporation

Bct Spectrum Inc.

Emerson Network Power - Embedded Computing, Inc.

John H Kelly

Charles Christopher Hill

Naufel Chafic Naufel

Henry Wong

Mark S Lanus

Irena Borucki

Markus Tegethoff

Kevin Loutfy

Dale C Blankenship

Eugene R Pilat

Dennis E Liles

A power distribution unit () may include a power distribution unit frame (), where the power distribution unit frame has a 2U form factor (), and where the power distribution unit frame is coupled to mount in an embedded computer frame (). A plurality of power ingress sites () may be coupled to a rear portion () of the power distribution unit frame, where each of the plurality of power ingress sites has a current capacity of at least 100 amperes, where each of the plurality of power ingress sites includes an ingress pin () coupled to interface with an ingress in-line, hyperboloid radial socket (), and where the power distribution unit has a current-capacity density of the plurality of power ingress sites of at least 600 amperes per power distribution unit.

High density power distribution unit

A method of monitoring a power distribution unit () may include providing a power distribution unit frame (), where the power distribution unit frame has a 2U form factor (), and where the power distribution unit frame is coupled to mount in an embedded computer frame (). An alarm module () may be coupled to a circuit breaker connection site () in the power distribution unit frame. The alarm module may detect whether a circuit breaker () is coupled to the circuit breaker connection site via a set of auxiliary contacts (). If the alarm module detects the circuit breaker, the alarm module monitors a set of shelf conditions. If the alarm module fails to detect the circuit breaker, the alarm module does not monitor the set of shelf conditions.

Method of monitoring a power distribution unit

An integrated power supply air inlet unit () coupled to slidably insert into a first interspace region () of an embedded computer chassis (), where the first interspace region is defined by a module portion (), a rear surface () and a first side surface (), includes a power supply () coupled to supply power to the embedded computer chassis, and a front surface () that is substantially perpendicular to the first side surface. A cooling air mass () is drawn into the embedded computer chassis through the front surface in a direction substantially perpendicular () to the front surface, where upon entering the integrated power supply air inlet unit the cooling air mass is turned substantially ninety degrees to flow over the module portion in a direction substantially parallel the front surface, and where the integrated power supply air inlet unit is hot-swappable in the embedded computer chassis.

Integrated power supply and air inlet unit

A method of directly transferring data across a CompactPCI&#x2122; backplane () via a fully meshed orthogonal network (). The CompactPCI backplane () incorporates a different type connector at its Plocation, in conjunction with a standard family of IEC 61074 connectors at its PPPand Plocations, to provide high speed data transfer with additional shielding and noise control.

Compact PCI backplane and method of data transfer across the compact PCI backplane

A method of directly transferring data across a CompactPCI&trade; backplane ( ) via a fully meshed orthogonal network ( ). The CompactPCI backplane ( ) incorporates a different type connector at its P location, in conjunction with a standard family of IEC 61074 connectors at its P , P , P , and P locations, to provide high speed data transfer with additional shielding and noise control.

A power system includes a cable connector ( ), a cable ( ) comprised of a plurality of wires ( , and ), and a circuit ( , or ) for sensing a connection for the cable connector. The circuit is located adjacent to the cable connector and is capable of sensing a predetermined connection condition of the connection of the cable connector. Each wire has an end located within the cable connector.

Power system and method of operation

A process control system is disclosed in which process variables are treated as mapped in n-dimensional space, where n is the number of orthogonal directions. Three functions, set, check, and term, provide the link between expected and actual conditions. The check and term functions operate on orthogonal coordinates. Each parameter has a guard band to provide a soft boundary for the parameter.

Process control with guard band and fault limit

Analog data is collected by conversion to a digital representation thereof via an analog to digital converter. Reference voltages for the converter are provided by digital to analog converters. The reference voltages are varied under the control of a central processing unit to establish a range of interest in the analog data. The range of interest is narrower than the conversion range of the analog to digital converter.

Growing community of inventors

Phoenix, AZ, United States of America

John H Kelly