Ferro Corporation

John H Alexander

Aziz S Shaikh

Todd K Williams

Simon P Turvey

Mark A Wesselmann

The present invention provides a thermally conductive material which can be used as a heat sink in a multi-chip module or multilayer circuit structure. The material is formed by firing a composition including a solids portion comprising from about 1% to about 30% by weight glass and from about 70% to about 98% by weight silver. The glass comprises in weight percent from about 5% to about 60% B.sub.2 O.sub.3, from about 30% to about 90% SiO.sub.2, up to 10% Li.sub.2 O, up to 10% Na.sub.2 O, up to 10% K.sub.2 O and up to 10% Al.sub.2 O.sub.3. The material may be formed using a second glass selected from the group comprising of (i) a glass comprising in weight percent from about 10% to about 60% CaO, from about 5% to about 55% B.sub.2 O.sub.3 and from about 5% to about 55% SiO.sub.2 ; and (ii) a glass comprising in weight percent from about 35% to about 70% SiO.sub.2, from about 20% to about 45% Al.sub.2 O.sub.3, from about 0% to about 8% BaO and from about 5% to about 30% MgO.

Conductive silver low temperature cofired metallic green tape

The present invention provides a method of producing a low temperature cofired electronic monolithic structure having one or more electronic components integrated therein comprising the steps of: A. providing a green electronic component; B. providing a stack of green low temperature cofired ceramic dielectric tape having an opening formed in the stack for receiving the green electronic component; C. placing the green electronic component in the opening in the stack to form a structure; and D. laminating and firing the structure so as to provide the monolithic electronic structure.

Method of integrating electronic components into electronic circuit

The present invention provides a method for making an insulated electrical heating element such as for domestic appliances to heat water, etc. wherein a resistive track is embedded in a dielectric ceramic insulating material. The method includes the steps of providing a rigid base plate; printing a resistive track on one surface of a segment of flexible tape comprising fusible ceramic particles in an organic binder; adhering the other surface of the tape segment to a surface of a base plate; and placing a second segment of flexible tape of the same type on the surface with the resistive track printed thereon. Then the resulting assembly is fired to fuse the ceramic particles of the tape segments and provide a ceramic layer on the base plate with an electrical resistive track insulated therewithin.

Method of making insulated electrical heating element using LTCC tape

The present invention provides a method for making a ceramic article having a cavity therein and at least one shelf portion protruding laterally into the cavity spaced from the cavity floor comprising the steps of constructing a laminated product using strips of tape comprising fusible ceramic particles and a binder, said strips being cut to predetermined dimensions and superposed so as to define a cavity with a floor and side walls, and with at least one horizontal shelf portion extending from a side wall into said cavity, the shelf portion being spaced above the floor; filling said cavity with a fugitive insert of multiple strips of tape to support the shelf portion; and firing the laminated product to fuse the particles and to burn off the fugitive insert to provide a ceramic article with a cavity and a shelf parallel to the cavity floor.

Method of making ceramic article with cavity using LTCC tape

The present invention provides a new and useful via fill paste for use in the construction of electronic circuit devices. The unique via fill paste is capable of electrically connecting conductive layers made of dissimilar metals such as gold and silver. The via fill paste includes gold, silver, palladium and a refractory oxide. The refractory oxide comprises one or more metals selected from the group consisting of zirconium, yttrium, niobium, tantalum, lanthanum, thorium, hafnium, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium and lutetium.

Via fill paste and method of using the same containing specific amounts

The invention provides a metallic composition and methods for making and using the same. In a preferred embodiment the metallic composition forms a conductor path and is bonded to a substrate of aluminum nitride. The metallic composition comprises Mo, Si, Cu and Mn. The Si may be present in the metallic composition as MoSi.sub.2. The metallic composition may be produced by firing a paste that has been applied to a substrate of aluminum nitride. The paste comprises an organic vehicle and a metallic powder. The metallic powder preferably comprises about 60% to about 90% by weight Mo, about 0.5% to about 15% by weight MoSi.sub.2, about 5% to about 20% Cu and up to about 20% by weight Mn.

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Goleta, CA, United States of America

John H Alexander