Meta Platforms Technologies, LLC

Facebook Technologies, LLC

John Goward

Chloe Astrid Marie Fabien

Christophe Antoine Hurni

Andrew John Ouderkirk

Daniel Henry Morris

Jasmine Soria Sears

Christopher Yuan Ting Liao

Matthieu Charles Raoul Leibovici

Jonathan Robert Peterson

Maik Andre Scheller

Nathan Seigo Matsuda

Michael Grundmann

Scott Charles McEldowney

Giuseppe Calafiore

Yu Shi

Stephen James McNally

Guohua Wei

Stephen John Holmes

Anurag Tyagi

Chadwick Brian Martin

Robin Sharma

Qi Zhang

Karol Constantine Hatzilias

Matthew E Colburn

Maxwell Parsons

Nihar Ranjan Mohanty

Alexander Koshelev

Selso Luanava

Daniel Guenther Greif

Ehsan Vadiee

Daniel Guenther Grief

For small, high-resolution, light-emitting diode (LED) displays, such as for a near-eye display in an artificial-reality headset, LEDs are spaced closely together. A backplane can be used to drive an array of LEDs in an LED display. A plurality of interconnects electrically couple the backplane with the array of LEDs. The backplane can have a different coefficient of thermal expansion (CTE) than the array of LEDs. During bonding of the backplane to the array of LEDs, CTE mismatch can cause misalignment of bonding sites. The higher the bonding temperature, the greater the misalignment of bonding sites. Lower temperature bonding, using materials with lower melting or bonding temperatures, can be used to mitigate misalignment during bonding so that interconnects can be more closely spaced, which can allow LEDs to be more closely spaced, to enable a higher-resolution display.

Bonding interface for hybrid TFT-based micro display projector

In a flip-chip LED assembly having an array of LEDs formed on the same substrate, different LEDs of the array have different distances to the n-contacts of the assembly. This may cause current crowding as current has to spread from the n-contacts through the substrate to each the farthest LEDs of the LED array, requiring LEDs that are farther away to be driven with a higher voltage in order to receive a desired amount of current. To spread current more evenly through the LED assembly and reduce a voltage difference between the closest and farthest LEDs of the array, a current spreading layer having a conductive material (e.g., a conductive oxide) is formed on a surface of the substrate of the LED assembly. The current spreading layer may be a bulk layer or be patterned to increase light extraction from the LEDs of the array.

LED array having transparent substrate with conductive layer for enhanced current spread

A high-voltage optical transformer may include (1) an array of light-emitting devices that are connected in parallel with one another and are electrically coupled to an electrical input, (2) a transfer medium, and (3) an array of photovoltaic cells that (A) are optically coupled to the array of light-emitting devices via the transfer medium, (B) are connected in series with one another, and (C) produce an electrical output whose voltage is higher than the electrical input. Various other apparatuses, systems, and methods are also disclosed.

Apparatus, system, and method for stepping up high voltages within small form factors via optical couplings including an array of photovoltaic cells optically coupled to parallelly connected light emitting devices via a transfer medium

A light source or projector for a near-eye display includes a light source subassembly optically coupled to a waveguide concentrator. The light source subassembly may include several semiconductor chips each hosting an array of emitters such s superluminescent light-emitting diodes. The semiconductor chips may be disposed side-by-side, with their emitting sides or facets coupled to the waveguide concentrator, which provides a tight array of output light ports on a common output plane of the concentrator. The output diverging beams at the array of output light ports are coupled to a collimator, which collimates the beams and couples them to an angular scanner for scanning the collimated light beams together across the field of view of the display.

Waveguide concentrator for light source

A method of forming a high voltage optical transformer includes forming a via through a transparent carrier wafer, forming a conductive layer within the via, bonding a solid state lighting (SSL) package to a first side of the carrier wafer, and bonding a photovoltaic (PV) wafer to a second side of the carrier wafer opposite to the first side. The photovoltaic wafer may include an active area and a conductive area located outside of the active area that is in electrical contact with the conductive layer. The method further includes forming both an SSL contact with the solid state lighting package and a PV contact with the conductive layer on the same side of the carrier wafer.

Wafer-level 3D integration of high voltage optical transformer

A device includes a light source to emit light and a light detector to receive the light emitted by the light source. The device may include a high voltage optical transformer and may be configured such that the light detector is laterally spaced away from the light source. In some architectures, the light source and the light detector may be arranged in a common plane. A photonic integrated circuit may be used to couple light emitted from the light source to the light detector.

Photonic power converter light transport

An optical dimming device is provided. The optical dimming device includes a photochromic element including a photochromic composition. The photochromic composition includes a combination of a first photochromic material and a second photochromic material having different steady-state absorption profiles. In a direction from a first portion to a second portion of the photochromic element, a concentration of the first photochromic material in the combination decreases and a concentration of the second photochromic material in the combination increases.

Gradient photochromic dimming device and optical assembly including the same

Disclosed herein are techniques for eye illumination for eye position tracking. An illuminator for eye tracking includes a substrate configured to be placed in front of an eye of a user and a light source positioned on a surface of the substrate. The light source is configured to be positioned within a field of view of the eye of the user. A maximum dimension of the light source in a plane parallel to an emission surface of the light source is less than 500 &#x3bc;m.

In-field illumination for eye tracking

A device includes an optical assembly and a digital projector. The optical assembly is configured to receive visible scene light at a backside of the optical assembly and to direct the visible scene light on an optical path toward an eyeward side. The optical assembly includes a dimming layer disposed on the optical path. The dimming layer includes a photochromic material that is configured to darken in response to exposure to a range of light wavelengths. The digital projector is disposed on the eyeward side of the optical assembly and is configured to selectively emit an activation light within the range of light wavelengths to activate a darkening of a region of the dimming layer to dim the visible scene light within the region.

Digital projector for local dimming in a device

For small, high-resolution, light-emitting diode (LED) displays, such as for a near-eye display in an artificial-reality headset, LEDs are spaced closely together. A backplane can be used to drive an array of LEDs in an LED display. A plurality of interconnects electrically couple the backplane with the array of LEDs. As spacing between LEDs becomes smaller than interconnect spacing, a thin-film circuit layer can be used to reduce a number or interconnects between the backplane and the array of LEDs, so that interconnect spacing can be larger than LED spacing. This can allow LEDs in the LED display to be more densely arranged while still allowing use of a silicon backplane with drive circuitry to control operation of the LEDs in the LED display.

Architecture for hybrid TFT-based micro display projector

An optical assembly is configured to receive visible scene light at a backside of the optical assembly and to direct the visible scene light on an optical path toward the eyeward side. The optical assembly also includes a dimming layer disposed on the optical path, where the dimming layer includes a photochromic material that is configured to darken in response to exposure to a range of light wavelengths. An activation layer, included in the optical assembly, is also disposed on the optical path and includes an in-field dimmer. The in-field dimmer is configured to selectively emit an activation light within the range of light wavelengths to activate a darkening of a region of the dimming layer to dim the visible scene light within the region.

Local dimming in a device

In a flip-chip LED assembly having an array of LEDs formed on the same substrate, different LEDs of the array have different distances to the n-contacts of the assembly. This may cause current crowding as current has to spread from the n-contacts through the substrate to each the farthest LEDs of the LED array, requiring LEDs that are farther away to be driven with a higher voltage in order to receive a desired amount of current. To spread current more evenly through the LED assembly and reduce a voltage difference between the closest and farthest LEDs of the array, one or more additional n-contacts are formed within the LED array. In some embodiments, the n-contacts may replace a pixel of the LED array. In other embodiments, one or more p-contacts of the LED array are resized or repositioned to accommodate the additional n-contacts without sacrificing pixels of the LED array.

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Redmond, WA, United States of America

John Goward