Intel Corporation

John Gorman

Davide Mantegazza

Kiran Pangal

Sandeep K Guliani

Mase J Taub

Balaji Srinivasan

Daniel Chu

Dany-Sebastien Ly-Gagnon

Lark-Hoon Leem

Kyung Jean Yoon

Fabio Pellizzer

Andrea Redaelli

Srivatsan Venkatesan

Davide Fugazza

Iniyan Soundappa Elango

A selection scheme for crosspoint memory is described. In one example, the selection voltage applied across the memory cell is slowly ramped up. Once the memory cell thresholds, the voltage is reduced to a level for performing the read or write operation. Reducing the voltage once the specific cell has been selected (e.g., thresholds) minimizes the additional transient current which might be generated by further increasing the selection bias applied during read or write operation. The reduction in transient current can lead to an improvement in read disturb and write endurance issues. The selection ramp-rate and bias post-selection can be set differently depending on the cell location inside the memory array to further improve cell performance.

Selection scheme for crosspoint memory

Various embodiments of a three-dimensional cross-point (3D X-point) memory cell design include one or more electrodes having an increased resistance compared to existing memory cell designs or compared to other electrodes within a same memory cell. A memory device includes an array of memory cells with each memory cell arranged between a word line and a bit line of the memory device. Some embodiments include additional material layers to increase memory cell resistance. Some embodiments include electrodes having an increased thickness to increase the resistance. Some embodiments include electrodes having a composition with a higher resistivity. Some embodiments include electrodes with increased interface resistance. Some embodiments include a combination of such features. In any case, the resulting increased memory cell resistance causes a reduction in the transient selection current for the given memory cell.

Memory device with increased electrode resistance to reduce transient selection current

In one embodiment, an apparatus comprises read circuitry to apply a read voltage to a three dimensional crosspoint (3DXP) memory cell; and write setback circuitry to apply a first setback pulse having a first magnitude to the 3DXP memory cell in response to the application of the read voltage, wherein applying the first setback pulse comprises bypassing a current mirror that is to limit or control a magnitude of a second setback pulse applied to the 3DXP memory cell when the current mirror is coupled to the 3DXP memory cell.

Method and apparatus for multi-level setback read for three dimensional crosspoint memory

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San Jose, CA, United States of America

John Gorman