Intel Corporation

John G Oldendorf

Michael Kochanowski

Shawn Lloyd

J Shelton Lewis

Scott A Gilbert

Peter A Davison

Steven L Pollock

Kurt A Jenkins

Charles M Bailley

Mike Lowe

Richard C Schaefer

Andrew J Balk

Venting for component mounting pads of surface mount circuit boards allows the escape of gases from the junction between an electrical component and its associated mounting pad during soldering and facilitates a more complete and effective solder joint between the component base and pad. The venting may be accomplished by either one or more through holes in the board through the pads to allow undesirable gases to escape to the underside of the board, or by one or more solder free channels formed in the pad to allow the gases to escape through the periphery of the pad.

Gas venting component mounting pad

The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be conducted away by the thermally conductive material and dissipated.

Via heat sink material

A socket may receive both ball grid and land grid array packages. Thus, in some embodiments, the early package prototypes, without solder balls, may be packaged in the same socket design that is ultimately used for production devices using ball grid array packaging. Both land grid array and ball grid arrays may be self-centered on the socket in some embodiments. An S-shaped spring contact may be utilized to electrically connect to either solder balls or lands in a wiping action.

Making electrical connections between a circuit board and an integrated circuit

An integrated circuit (IC) package socket is provided with an array of single-piece socket contact pins arranged to connect an IC package to a circuit board. The single-piece contact pin is supported at a middle portion of the contact pin and includes two acutely angled bends that allow the two ends of the contact pin to independently resiliently engage the package lands of the IC package and the contact pads of the circuit board. The contact pins are further shaped and arranged to laterally swipe the package lands and contact pads during engagement to scrape away or penetrate through any oxide or other contaminant buildup.

Integrated circuit package socket and socket contact

A device includes a substrate. The substrate further includes a first major surface including a plurality of lands, and a second major surface. At least one component is attached to at least some of the plurality of pads on the first major surface. At least one sacrificial component is attached to the first major surface. The at least one component has a first height with respect to the first major surface, and the at least one sacrificial component has a second height with respect to the first major surface. The second height is greater than the first height. The sacrificial component includes a fuse.

Sacrificial component

A cooling system is provided with a heat exchanger that has a thermally conductive tube over-molded with a plurality of thermally conductive fins. To form the heat exchanger, a thermally conductive tube is provided. Insert molding, over molding or injection molding is utilized to incorporate thermally conductive fins with the thermally conductive tubes. The molding process may also simultaneously create any required features, such as mounting features and fittings for tubing to be connected to the heat exchanger.

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Portland, OR, United States of America

John G Oldendorf