Consolidated Refining Company, Inc.

John G Ciallella

Richard Gordon

A ceramic lid assembly includes an integral heat fusible layer defining a hermetic sealing area provided around the periphery of a ceramic lid for hermetic sealing semiconductor chips in a flat pack. The integral heat fusible layer includes a metallized layer, an oxidation inhibiting layer, and a preflowed solderable layer in registration with each other in the hermetic sealing area.

Method of making ceramic lid assembly for hermetic sealing of a

A lid assembly includes an integral heat fusible layer defining a hermetic sealing area provided around the periphery of a lid for hermetic sealing semiconductor chips in a flat pack. The integral heat fusible layer includes a flowed solderable layer in the hermetic sealing area.

Lid assembly for hermetic sealing of a semiconductor chip

A ceramic lid assembly includes an integral heat fusible layer defining a hermetic sealing area provided around the periphery of a ceramic lid for hermetic sealing semiconductor chips in a flat pack. The integral heat fusible layer includes a metallized layer, an oxidation inhibiting layer, and a flowed solderable layer in registration with each other in the hermetic sealing area.

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White Plains, NY, United States of America

John G Ciallella