Novellus Systems Incorporated

Other

Asm IP Holding B.v.

Speedfam-ipec Corporation

John F Stumpf

Brian Severson

Stephen C Schultz

David T Marquardt

James Jed Crawford

Timothy S Dyer

John Derwood Herb

Edmund Minshall

Robert Marshall Stowell

Timothy Patrick Cleary

Rand Conner

Michael D Smigel

Kevin Bertsch

Franklin D Root

Antoni F Jakubiec

Jasent Montano

Joe E Koeth

James Ekberg

Chris Wuester

Laurie Stumpf

A counterflow mixing device for a process chamber is disclosed, comprising an injection tube that introduces a fluid in a manner counter to a flow of a post-plasma gas mixture traveling downward from a plasma source. The invention allows for proper mixing of the fluid as well as avoiding recombination of generated ions and radicals.

Counter flow mixer for process chamber

A transducer system includes a plurality of transducer elements formed on a flexible substrate with localized circuit elements and interconnects associated with each transducer element.

Transducer matrix film

A monitoring system for use with a leg hole device includes a sensor for monitoring a state of at least one leg of a child engaged with the leg hole device, a control system, and a user interface. A state of presence or absence of at least one leg may be monitored.

Child leg monitoring system and method

An edge control system for deployment on a CMP carrier head comprising a bladder and a carrier head housing having a passage extending therethrough. The bladder includes a flexible diaphragm and is coupled to the carrier head housing. The edge control system comprises first and second annular ribs, each of which comprises a first end portion sealingly coupled to the carrier head housing, a second end portion coupled to the diaphragm, and a strain relief member substantially intermediate the first end portion and the second end portion. A plenum is substantially defined by the first and second annular ribs and the carrier head housing. The passage is fluidly coupled to the plenum to permit the pressurization of the plenum, and the strain relief member promotes the extension of the first and second annular ribs away from the carrier head housing when the plenum is pressurized.

Carrier head for workpiece planarization/polishing

In accordance with one embodiment of the invention, a load cup mechanism is provided for loading and unloading apparatus such as a CMP apparatus. The load cup mechanism, configured to load a work piece into and to unload a work piece from the apparatus, comprises a load cup arm configured to pivot about an axis between a load position aligned with the apparatus and an off-load position. A work piece platform is coupled to an end of the load cup arm and a plurality of lift fingers and a plurality of guide fingers, configured to support and center a work piece, are spaced about the work piece platform. A plurality of guide posts are spaced apart about the periphery of the work piece platform and are configured to align the work piece platform, in the load position, to the processing apparatus.

CMP apparatus and load cup mechanism

A carrier head for supporting a workpiece is provided. The carrier head comprises a mount plate having an aperture therethrough, and a clamp ring having a foot portion and a first leg portion extending therefrom. The first leg portion extends through the aperture, and the foot portion abuts the mount plate proximate the aperture. A flexible bladder has first and second ribs that are received between the mount plate and the foot portion. An annular fastener is removably coupled to the leg portion, and engages the mount plate to cause the first and second ribs to be sealingly secured between the mount plate and the foot portion.

Methods and apparatus are provided for the chemical mechanical planarization (CMP) of a surface of a work piece. In accordance with one embodiment of the invention the apparatus comprises a plurality of CMP systems, a plurality of load cups for loading unprocessed work pieces into and unloading processed work pieces from the plurality of CMP systems, a plurality of cleaning stations for cleaning processed work pieces unloaded from the CMP systems, and a single robot configured to transfer unprocessed work pieces to the plurality of load cups and to transfer processed work pieces from the load cups to the plurality of cleaning stations.

CMP apparatus and method

Components of chemical, mechanical, polishing apparatus with components resistant to chemical attack by chemical slurries used in the polishing of semiconductor wafers. Among the components that are improved to enhance resistance to chemical attack are the polishing platen, pad conditioning end effectors, various subassemblies, housings for instrumentation, carrier rinse station surfaces, and other components that come into contact with a slurry. The coating compositions are preferably tightly adherent to the underlying substrate, and may be applied by a wide range of techniques. Especially useful are coatings such as tungsten carbide, tungsten nitride, amorphous diamond like carbon, and other such inert wear resistant coatings.

Growing community of inventors

Phoenix, AZ, United States of America

John F Stumpf