Intel Corporation

Intel Corportation

John F McMahon

Ravi V Mahajan

George W Chiu

Koushik Banerjee

Michael R Stark

Mostafa A Aghazadeh

Frank Kolman

Barbara Jane Ultis

William G Loder

Sanjay Gupta

A multi-chip package and a method of manufacturing the same. The multi-chip package of the present invention has a plurality of shelves. A first semiconductor is electrically coupled to at least one of the package's shelves. A second semiconductor die is electrically coupled to at least one of the package's shelves, wherein the second semiconductor die is above said first semiconductor die.

Stacked chip packaging

An electronic cartridge which has a fastener that can attach the cartridge to a motherboard. The fastener is captured by a cover that also captures a substrate. The substrate may be coupled to a connector that is mounted to the motherboard. The fastener may be attached to a retention mechanism that is also mounted to the motherboard. The fastener may have a threaded portion that is screwed into a corresponding threaded aperture of the retention mechanism. The fastener and retention mechanism provide a rugged attachment of the cartridge to the motherboard. The cover and retention mechanism may be constructed from an electrically conductive material which provides a shield to electro-magnetic interference (EMI).

Retention mechanism assembly for processor cartridges with captured screw fasteners

A flip chip integrated circuit package which provides stress relief for the solder bumps of the package. The package includes an integrated circuit that is mounted to a substrate. The integrated circuit is attached to a plurality of bond pads of the substrate by a number of corresponding solder bumps. The substrate has a first layer that is attached to a second layer. An area that is located between the layers and adjacent to the bond pads is left unattached so that a portion of the first layer can move independent of the remaining portion of the substrate. The unattached area allows the integrated circuit to &ldquo;float&rdquo; and expand at a different rate than the substrate when the package is thermally cycled.

Organic substrate (PCB) slip plane &ldquo;stress deflector&rdquo; for flip chip devices

An integrated circuit device. The integrated circuit device includes a semiconductor substrate having a first surface and a second surface opposite the first surface. Circuit elements are formed within the first surface. A plurality of bump contacts are located on the first surface and connected to the circuit elements. Bond pads that are also connected to circuit elements are located within or on the second surface.

Flip-chip having electrical contact pads on the backside of the chip

An electronic assembly that includes a plurality of electronic substrates that are plugged into a polygonal shaped motherboard. The polygonal shape of the motherboard minimizes the electrical path between electronic substrates while providing enough space between adjacent substrates to allow a fluid to sufficiently remove heat generated by integrated circuits of the substrates.

Computer package with a polygonal shaped motherboard

An integrated circuit package that receives power from a connector clipped to an edge of the package. The IC package has at least one pair of contact strips that extend along an edge of the package. The strips are connected to the power and ground pads of the integrated circuit by internal routing of the package. The connector has a plurality of conductive spring fingers that clip onto the contact strips of the package. The connector supplies power to the package through a cable connected to an external power supply. The package may have a number of separate connectors that provide different voltage levels to the integrated circuit. The IC package may have a plurality of contacts that extend from the package and are mounted to a printed circuit board.

High performance power and ground edge connect IC package

An electronic package which contains discrete resistive and capacitive components used to control the operating device of an integrated circuit located within the package. The package has a bonding shelf that has a plurality of bond fingers which are connected to the integrated circuit. The discrete passive components are mounted to the bonding shelf and connected to the bond fingers by lead traces. The lead traces terminate at the discrete devices so that the resistor and capacitor cannot be accessed through the external contacts of the package. The integrated circuit and discrete components are typically enclosed by a molded plastic material to prevent physical access to the devices without damaging the package.

Design for mounting discrete components inside an integrated circuit

An integrated circuit package that has no internal routing or vias within the substrate of the package. The package includes a substrate that has a plurality of bond pads and connecting contact pads located on an outer first surface of the substrate. An integrated circuit is mounted to the first surface and coupled to the bond pads. Mounted to the substrate is a solder rack which contains a plurality of contacts that couple the contact pads to an external printed circuit board.

Integrated circuit solder-rack interconnect module

A flip chip integrated circuit package which provides stress relief for the solder bumps of the package. The package includes an integrated circuit that is mounted to a substrate. The integrated circuit is attached to a plurality of bond pads of the substrate by a number of corresponding solder bumps. The substrate has a first layer that is attached to a second layer. An area that is located between the layers and adjacent to the bond pads is left unattached so that a portion of the first layer can move independent of the remaining portion of the substrate. The unattached area allows the integrated circuit to 'float' and expand at a different rate than the substrate when the package is thermally cycled.

Organic substrate (PCB) slip plane 'stress deflector' for flip chip

An electronic package which has a plurality of stacked integrated circuit dies. The package includes a first die that is mounted to a die paddle of a lead frame. The first die is also connected to the leads of the lead frame by bond wires. A second die is mounted to the top surface of the first die and electrically connected to the first die with bond wires. The first die, second die and die paddle are all enclosed by a package.

Multi-chip integrated circuit package

An electronic package for an integrated circuit (IC). The package has a plurality of first pins extending from a laminated plastic/printed circuit board substrate. The pins are coupled to the integrated circuit and provide a means for mounting the package to an external printed circuit board. The package also has an internal circuit board that is coupled to both the substrate and the IC by a plurality of second pins. Mounted to the circuit board are passive and/or active electrical elements that are connected to the integrated circuit through the second pins. Some of the second pins may extend entirely through the substrate to directly couple the internal circuit board and electrical elements to the external printed circuit board. To improve the thermal impedance of the package, the integrated circuit is mounted to a heat slug which can be attached to a heat sink. The heat sink may also provide a substrate for the internal circuit board.

Shared socket multi-chip module and/or piggyback pin grid array package

A printed circuit board assembly that has a first electronic package which is coupled to a printed circuit board and a second electronic package that is plugged into the first electronic package. The first electronic package can be coupled to the printed circuit board by leads, pins that plug into corresponding sockets mounted to the circuit board, or a SMT socket adapter that is mounted to the board. The first package also has a plurality of pins that extend through an opening in the printed circuit board. The second package has a plurality of sockets that can be plugged onto the pins of the first package to couple the second package to the first package.

Kangaroo multi-package interconnection concept

A roll of tape with solder forms and methods for transferring the solder forms only or both the solder forms and portions of the tape to electronic components are disclosed. Electronic components may be any of integrated circuit chips, chip packages and printed circuit boards. Transferring solder forms to electronic components is a two-step process: (a) the solder forms are positioned and placed on a roll of tape off-line and (b) the solder forms on the roll of tape are transferred to the electronic components in an assembly line. The solder forms may be temporarily or permanently attached to the tape. In the first instance, only the solder forms are transferred. In the latter instance, tape portions are transferred to the electronic components with the solder forms. The solder forms may be attached to one side of the tape or in through-holes in the tape using either UV sensitive adhesives or cold adhesives such as solder flux. The solder forms may be released by pressing the solder forms against the electronic components, exposing the UV sensitive adhesives to UV light or using a 'bed of nails'. In addition, the solder forms maybe shaped as balls, cylinders, polygonal boxes, barrels or hour glasses. The tape is thermally conductive and heat resistant and may have impregnated materials such as ceramic, aluminum nitride or solder flux to improve its thermal, mechanical and/or electrical properties.

Tape withh solder forms and methods for transferring solder forms to

A roll of tape with solder forms and methods for transferring the solder forms only or both the solder forms and portions of the tape to electronic components are disclosed. Electronic components may be any of integrated circuit chips, chip packages and printed circuit boards. Transferring solder forms to electronic components is a two-step process: (a) the solder forms are positioned and placed on a roll of tape off-line and (b) the solder forms on the roll of tape are transferred to the electronic components in an assembly line. The solder forms may be temporarily or permanently attached to the tape. In the first instance, only the solder forms are transferred. In the latter instance, tape portions are transferred to the electronic components with the solder forms. The solder forms may be attached to one side of the tape or in through-holes in the tape using either UV sensitive adhesives or cold adhesives such as solder flux. The solder forms may be released by pressing the solder forms against the electronic components, exposing the UV sensitive adhesives to UV light or using a 'bed of nails'. In addition, the solder forms may be shaped as balls, cylinders, polygonal boxes, barrels or hour glasses. The tape is thermally conductive and heat resistant and may have impregnated materials such as ceramic, aluminum nitride or solder flux to improve its thermal, mechanical and/or electrical properties.

Tape with solder forms and methods for transferring solder to chip

An electronic package assembly that includes a flexible circuit wrapped around a metal substrate. The leads of the flexible circuit are connected to an integrated circuit that is mounted to the top surface of the substrate. The flexible circuit has a plurality of metal pads located adjacent to the bottom surface of the substrate. The flexible circuit also contains a power/ground plane and a number of conductive signal lines that couple the integrated circuit to the metal pads. The pads can be soldered to a printed circuit board to electrically couple the integrated circuit to the board.

Growing community of inventors

Phoenix, AZ, United States of America

John F McMahon