Shipley Company LLC

Digital Equipment Corporation

John F Bohland

Walter J Dressick

Jeffrey M Calvert

Jacque H Georger, Jr

Gary S Calabrese

Mu-San Chen

Charles S Dulcey

Edward K Pavelchek

Susan K Jones

Bruce W Dudley

Peter W Freeman

The invention is directed to a process for patterning a substrate in a selective pattern. In one embodiment, the process comprises the steps of forming a patterned coating over a substrate surface whereby portions of the substrate are covered by the patterned coating and portions of the substrate remain uncoated. A layer of a ligating material is coated over at least those portions of the substrate free of the patterned coating. The ligating layer is one that is capable of ligating with an electroless metal plating catalyst. The article so formed is then contacted with an electroless metallization catalyst and then with an electroless plating solution to form a patterned metal deposit on the substrate.

Selective metallization process

The present invention comprises methods for treating photoresists and forming photoresist relief images, including a method comprising providing a photoresist coating having a crosslinked surface layer, treating the photoresist coating with an organometallic material, and developing the photoresist coating to provide a relief image comprising an etch resistant effective amount of organometallic material.

Methods for treating photoresists

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Berlin, MA, United States of America

John F Bohland