Micron Technology Incorporated

Illinois Tool Works Inc.

John E Vannortwick

Tongbi T Jiang

Chad A Cobbley

Ed A Schrock

Michael R Slaughter

Valoris L Forsyth

Christopher E Casey

Justin L Lawrence

James R Stoor

Jamie J Wanke

Michael R Forbis

The disclosure relates to trays for the handling and shipping of computer chips, or similar microelectronic devices. The tray include a series of channels, each extending along a width of the tray. The channels include such devices as pins and clips for securing a thermoformed tape. The thermoformed tape includes pockets for storing the various computer chips, or similar microelectronic devices.

Devices and method for handling microelectronics assemblies

A method of applying a dispersion (which may be in the form of a paste) of particles of a thermoplastic polymer in a liquid medium (i.e., liquid carrier) onto semiconductor wafers, dies, lead frames, and printed circuit boards, for example, to form bonding layers, pads, and bumps, etc.

Method of depositing a thermoplastic polymer in semiconductor fabrication

A semiconductor device assembly having a support such as a lead frame paddle comprises a coating thereon to reduce or eliminate the flow of die attach adhesive from under the die and over bond sites or encapsulation regions. Thus undesirable effects resulting from this flow of adhesive, such as wire bonding problems and encapsulation problems, are reduced. A method for forming the assembly is also described.

Method and apparatus for reducing resin bleed during the formation of a

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Kuna, ID, United States of America

John E Vannortwick