United States of America As Represented by the Administrator of Nasa

John E Sadleir

Kevin L Denis

Manuel A Balvin

Thomas R Stevenson

Peter C Nagler

A method of forming low-energy x-ray absorbers. Sensors may be formed on a semiconductor, e.g., silicon, wafer. A seed metal layer, e.g., gold, is deposited on the wafer and patterned into stem pads for electroplating. Stems, e.g., gold, are electroplated from the stem seed pads through a stem mask. An absorber layer, e.g., gold, is deposited on the wafer, preferably e-beam evaporated. After patterning the absorbers, absorber and stem mask material is removed, e.g., in a solvent bath and critical point drying.

Method of fabricating x-ray absorbers for low-energy x-ray spectroscopy

The present invention relates to a method and apparatus of protecting magnetically sensitive devices with a shield, including: a non-superconducting metal or lower transition temperature (T) material compared to a higher transition temperature material, disposed in a magnetic field; means for creating a spatially varying order parameter's |&#x3a8;(r,T)|in a non-superconducting metal or a lower transition temperature material; wherein a spatially varying order parameter is created by a proximity effect, such that the non-superconducting metal or the lower transition temperature material becomes superconductive as a temperature is lowered, creating a flux-free Meissner state at a center thereof, in order to sweep magnetic flux lines to the periphery.

Method and apparatus of implementing a magnetic shield flux sweeper

Methods for forming sensors using transition edge sensors (TES) and sensors therefrom are described. The method includes forming a plurality of sensor arrays includes at least one TES device. The TES device includes a TES device body, a first superconducting lead contacting a first portion of the TES device body, and a second superconducting lead contacting of a second portion of the TES device body, where the first and second superconducting leads separated on the TES device body by a lead spacing. The lead spacing can be selected to be different for at least two of the plurality of sensor arrays. The method also includes determining a transition temperature for each of the plurality of sensor arrays and generating a signal responsive to detecting a change in the electrical characteristics of one of the plurality of sensor arrays meeting a transition temperature criterion.

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Washington, DC, United States of America

John E Sadleir