Unisys Corporation

John E Rudy

Kenneth N Abel

Scott H Hayashida

Vivek Ladha

Isam W Akkawi

A multiprocessor data processing system comprises a plurality of unsymmetrically connected data processing nodes; where the total number of nodes is more than 2.sup.n-1 and less than 2.sup.n, and n is an integer larger than two Each node has n input/output channels which respectively are channel(0), channel(1), channel(2), etc.; each node has a binary address b.sub.n-1. . . b.sub.1 b.sub.0 which runs consecutively from node to node; each pair of nodes whose binary addresses differ by only one binary bit b.sub.x are interconnected by a channel(x) to channel(x) connection; and, at least one pair of nodes whose binary addresses differ by two binary bits b.sub.x and b.sub.y are interconnected by a channel(x) to channel(y) connection, where x and y=0,1, . . . n-1. To establish a route from any one node to any other node, channels are selected which decrease the distance to the destination by two nodes or one node or maintain the same distance.

Multiprocessor data processing system having nonsymmetrical channel(x)

This invention is an improvement to an integrated circuit package which is of a type that includes a package body with multiple chip attach regions for holding respective integrated circuit chips, signal pads around the chip attach regions, an array of I/O pins on the package body, a first set of conductors in the package body which selectively connect some of the signal pads to the I/O pins, and a second set of conductors which selectively connect some of the signal pads to each other but not to any I/O pins. This improvement enhances the testability of the package at its intermediate state of manufacture, and it comprises: (a) a test region in the package body which is spaced apart from the I/O pins, the chip attach regions, the signal pads, and the first and second sets of conductors; (b) an array of test pins which is attached to the test region of the package body; and (c) a third set of conductors which are disposed in the package body that selectively connect the I/O pins to the signal pads and the first and second sets of conductors such that all conductive paths can be tested for shorts and/or opens via the test pins and the I/O pins. Then, after testing is complete, the test region of the package body is permanently removed from the remainder of the package by a step such as sawing.

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Poway, CA, United States of America

John E Rudy