Harris Corporation

John E Rogers

Michael Raymond Weatherspoon

Ronald Edward Jackson, Jr

Integrated Microelectromechanical System ('MEMS') devices and methods for making the same. The integrated MEMS device comprises a substrate () with first electronic circuitry () formed thereon, as well as a MEMS filter device (). The MEMS filter device has a transition portion () configured to (a) electrically connect the MEMS filter device to second electronic circuitry and (b) suspend the MEMS filter device over the substrate such that a gas gap exists between the substrate and the MEMS filter device. The transition portion comprises a three dimensional hollow ground structure () in which an elongate center conductor () is suspended. The RF MEMS filter device also comprises at least two adjacent electronic elements () which are electrically isolated from each other via a ground structure of the transition portion, and placed in close proximity to each other.

Integrated microelectromechanical system devices and methods for making the same

Embodiments of switches () include first and second electrical conductors () suspended within an electrically-conductive housing (), and a contact element () having an electrically-conductive portion () that establishes electrical contact between the first and second electrical conductors () when the contact element () is in a closed position. The electrically-conductive portion () is electrically isolated from a ground plane () of the switch () by adjacent electrically-insulative portions () of the contact element ().

Switches for use in microelectromechanical and other systems, and processes for making same

Embodiments of switches () include electrically-conductive housings (), and electrical conductors () suspended within and electrically isolated from the housings (). Another electrical conductor () is configured to move between a first position at which the electrical conductor () is electrically isolated from the electrical conductors () within the housings (), and a second position at which the electrical conductor () is in electrical contact with the electrical conductors () within the housings (). The switches () further include an actuator () comprising an electrically-conductive base () and an electrically-conductive arm () having a first end restrained by the base (). The electrical conductor () is supported by the arm (), and the arm () is operative to deflect and thereby move the electrical conductor () between its first and second positions.

Radio frequency system () which includes a first and second sub-assembly (), each formed of a plurality of layers of conductive material () disposed on a substrate () and arranged in a stack. The stacked layers form signal processing components () and at least one peripheral wall () surrounding a walled area () of each substrate. The second sub-assembly is positioned on the first sub-assembly with a first walled area of a first substrate aligned with a second walled area of a second substrate.

Method of making a monolithically integrated RF system

Miniaturized devices such as MEMS switches () have encapsulating enclosures (). The enclosure () and the remainder of the switch () are fabricated on a concurrent basis by depositing layers of an electrically-conductive material, such as copper, on a substrate ().

Processes for fabricating MEMS switches and other miniaturized devices having encapsulating enclosures

Embodiments of coupler systems () include a directional coupler (), a tuning element (), and an actuator (). The coupler () is configured to split an input signal into two output signals or, alternatively, to combine two input signals into a single output. The tuning element () is a capacitive device that allows the frequency response of the coupler () to be varied, so that the coupler () can be tuned to a particular frequency or range of frequencies at a given operating condition. The actuator () generates a mechanical force that actuates tuning element ().

Directional couplers with variable frequency response

Monolithically integrated RF system and method of making same

Embodiments of phase shifters () include electrical conductors () suspended within an electrically-conductive housing (), and a shuttle () having an electrically-conductive plate () that provides a variable capacitance between a ground potential and the electrical conductor () when the shuttle () is moved between a first and second position. The plate () is electrically connected to a ground plane () of the phase shifter () by adjacent electrically-conductive portions () of the shuttle ().

Phase shifters and tuning elements

Integrated Microelectromechanical System ('MEMS') devices and methods for making the same. The MEMS devices comprise a substrate () and a MEMS filter device () mechanically suspended above a major surface of the substrate. A first gas gap () exists between the major surface of the substrate and the MEMS filter device. An isolation platform () is provided to absorb vibrations from an external environment prior to reaching the MEMS filter device. In this regard, the isolation platform comprises: a frame structure () framing a periphery of the MEMS filter device; and at least one resilient component (-) coupled between the frame structure and the MEMS filter device. The frame structure is mechanically connected to the substrate. Electronic circuitry is connected to the MEMS filter device via a resilient interconnection () that is movable in at least one direction of the vibrations.

Microelectromechanical system with a micro-scale spring suspension system and methods for making the same

A switch includes a shuttle having an elongated length resiliently supported at opposing ends thereof and configured to move along a motion axis in response to an applied voltage. A shuttle switch portion includes a plurality of shuttle contact fingers extending transversely from opposing sides of the shuttle. A common contact at a common terminal side of the shuttle includes a plurality of contact fingers respectively interdigitated with the shuttle contact fingers. First and second terminal contacts are adjacent a switched terminal side of the shuttle, and include first terminal contact fingers and second terminal contact fingers respectively interdigitated with shuttle contact fingers. The shuttle switch portion is configured to selectively connect the common contact to the first terminal contact or the second terminal contact.

Microelectromechanical switches for steering of RF signals

A method for constructing a MEMS system includes first depositing on a surface of a substrate a first plurality of thin film layers formed of dielectric material. The first plurality of thin-film layers includes at least one conductive trace extending a distance on the substrate, parallel to the surface. A second plurality of layers is then deposited to form at least one MEMS device. The MEMS device is responsive to a control signal applied to a first input terminal and an electrical connection is formed from the conductive trace to the input terminal.

Control circuitry routing configuration for MEMS devices

An integrated Microelectromechanical Systems ('MEMS') device (). The MEMS device comprises a substrate (), a transition portion (), and a differential inductor (). The transition portion is connected to and at least partially extends transversely away from a major surface of the substrate. The differential inductor is mechanically suspended above a major surface of the substrate at least partially by the transition portion. The differential inductor is also electrically connected to an electronic circuit external thereto by the transition portion. A first dielectric gap exists between the major surface of the substrate and the differential inductor.

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Vero Beach, FL, United States of America

John E Rogers