The Boeing Company

Other

Theboeing Company

Raytheon Company

University of Florida Research Foundation Inc

John E Rogers

John Dalton Williams

Robert Alan Smith

Corey McKinney Thacker

Ted Ronald Dabrowski

Mark Sheplak

David Keith Mefford

Yong Kyu Yoon

Larry Leon Savage

Preston Tyler Bushey

Timothy Doyle Messer

Jack Judy

Michael Francis Mitchell

Kalsi Kwan

A flexible electronics assembly including a substrate including one or more dielectrics. A cavity is formed within the substrate. A first ground plane is secured to the substrate. One or more stress channels are formed through one or more portions of the substrate and the first ground plane. An electronics component is disposed within the cavity.

Method of forming a flexible electronics assembly

Described herein is an apparatus and a method for a low-profile, circularly polarized antenna. The antenna comprises a first substrate having a first side and a second side; an antenna element on the first side of the first substrate; a first conductor on the second side of the first substrate proximity coupled to the antenna element; a second conductor on the second side of the first substrate proximity coupled to the antenna element and ±90 degrees out of phase with the first conductor; a second substrate under the first substrate having a least one air gap therein under the antenna element; a third substrate under the second substrate having a first side and a second side; and an electrical ground plane on the second side of the third substrate.

Low-profile circularly-polarized antenna

Methods and systems for a steerable antenna array are disclosed. The antenna array includes an array of antenna elements aligned in rows and columns on a substrate. Additionally, the antenna array includes a microstrip feed within the substrate, where the feed is configured to electromagnetically couple to each antenna element of the array of antenna elements. The antenna array further includes a ground plane within the substrate. Additionally, for each antenna element, the antenna array includes a first cavity disposed between the ground plane and feed, and a second cavity disposed on the other side of the ground plane from the first cavity. The antenna array further includes a plurality of fluid lines configured to selectively add or remove fluid from the cavities coupled to the fluid line and cause a deflection of the ground plane in a region of the cavities coupled to the fluid line.

Pneumatically driven steerable antenna array

Systems and methods for measuring air gaps between opposing surfaces of two structural components. In one application, such measurements are used to fabricate a shim that fills the air gap between two structural members, such as parts of an aircraft. The resonant inductive coupling-based sensing system has the capability to remotely measure an air gap using an on-board transmit system. Furthermore, the system has the capability to switch between multiple inductor-capacitor sets such as to simultaneously measure air gaps across an area so that a better profile of the air gap can be determined. The resonant inductive coupling-based gap sensor is configured as signal generating and signal sensing electronics printed or mounted on respective flexible substrates to provide a flexible and portable measurement solution.

System for sensing miniature gaps by inductive coupling

An antenna assembly includes one or more dielectrics having a first surface and a second surface opposite from the first surface. An antenna layer includes one or more antenna elements disposed on the first surface of the one or more dielectrics. A stripline feed network is disposed on or within the one or more dielectrics. One or more cavities are formed in the one or more dielectrics. The one or more cavities are disposed below the one more antenna elements.

High gain stripline antenna assemblies

An antenna assembly includes a first magnetic substrate having a first surface and a second surface opposite from the first surface. One or more antenna elements are disposed on the first surface of the first magnetic substrate. A microstrip feed line is disposed on the second surface of the first magnetic substrate. A second magnetic substrate is secured to the first magnetic substrate. The second magnetic substrate includes one or more cavities aligned with the one or more antenna elements and the microstrip feed line.

Low-profile magnetic antenna assemblies

Aspects of the disclosure are directed to an antenna assembly having a first conductive element having a bowtie shape, the first conductive element on a dielectric material at a first layer; a feed point within the bowtie; a second conductive element as a feed line, at a second layer, wherein the second conductive element is electrically coupled to the first conductive element at least at the feed point, independently of direct electrical contact between the first conductive element and the second conductive element; and a ground plane. In some implementations, the second conductive element has no direct electrical contact with the first conductive element, and electrical coupling of the conductive elements comprises electric fields within the dielectric. This reduces the risk of electrical performance degradation caused by mechanical damage at the feed point, such as when the antenna assembly is installed to conform to a non-planar surface.

Electrically coupled bowtie antenna

An antenna assembly includes a plurality of antenna elements, a microstrip feed network that is configured to supply power to the plurality of antenna elements, and one or more resistors disposed within the microstrip feed network proximate to one or more of the plurality of antenna elements. The resistors are configured to control sidelobes of the antenna assembly.

Sidelobe-controlled antenna assembly

A method of forming an electronics assembly includes providing a substrate, attaching an electronics component to the substrate, disposing one or more dielectric ramps on the substrate along at least a portion of a perimeter of the electronics component, disposing a first ground plane over the substrate and the dielectric ramp(s), disposing a first dielectric over the first ground plane, disposing a stripline over the first dielectric, disposing a second dielectric over the stripline and the first dielectric, and disposing a second ground plane over the second dielectric.

Method of forming a low loss electronics assembly

An integrated antenna assembly includes one or more antenna elements, one or more electronics components, and one or both of a static discharge element disposed between the antenna element(s) and the electronics component(s) and/or one or more thermal dissipators.

Antenna assemblies having energy dissipation mechanisms

A system for remote sensing of air gaps includes a substrate and a capacitor sensor array attached to the substrate, where the capacitor sensor array includes a plurality of capacitor sensors. The system also includes a transmit antenna attached to the substrate, and a microprocessor electrically connected to the transmit antenna and the capacitor sensor array. The microprocessor is configured to switch on and off at least one capacitor sensor of the plurality of capacitor sensors and to transmit determined air gap measurements using the transmit antenna.

Systems and methods for remote sensing of air gaps using a capacitor sensor array

A gas sensor for detecting a gas in an environment is disclosed. The gas sensor comprises a housing having a cavity and a vent hole within the housing and a distributed element resonator within the cavity. The cavity includes a bottom surface and a top surface, and the housing is configured to receive the gas from the environment into the cavity through the vent hole. The distributed element resonator has an input terminal configured to receive a radio frequency input signal and an output terminal configured to produce an output signal.

Gas sensor with an RF resonator

A pressure sensor includes an input terminal configured to receive an electrical input signal and an output terminal configured to provide an electrical output signal in response to the electrical input signal. The pressure sensor also includes an acousto-mechanical diaphragm and an electrically conductive element formed on the acousto-mechanical diaphragm. The pressure sensor further includes a distributed element filter configured to capacitively couple the input terminal to the output terminal. The distributed element filter is spaced from the electrically conductive element by an air gap. The air gap changes in response to a deflection of the acousto-mechanical diaphragm caused by a change in pressure on the acousto-mechanical diaphragm.

Pressure sensor and system for measuring pressure

An apparatus for vialess transitions can include a first dielectric layer. The apparatus can also include a first conductor forming a first coupling element on the top surface of the first dielectric layer. The apparatus can further include a second dielectric layer positioned below the first dielectric layer and above a third dielectric layer, wherein the second dielectric layer is vialess. The apparatus can include a second conductor forming a second coupling element, wherein the second conductor is on the top surface of the third dielectric layer, and a portion of the first coupling element is directly above a portion of the second coupling element.

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Owens Cross Roads, AL, United States of America

John E Rogers