Johnstech International Corporation

John E Nelson

David A Johnson

Jeffrey C Sherry

Sarosh M Patel

Gary William Michalko

Brian Warwick

Michael W Andres

Russell F Oberg

Patrick J Alladio

Jose E Lopez

John W O'Sullivan

Ranauld Perez

Donald L Fulcher

David Johnson

Chad Van Hove

Martin L Cavegn

William S Clark

Gary W Michalko

Tip for integrated circuit test pin

The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are protected against damage from balls on a DUT by a protective ball guide which includes recesses for receiving part of the ball but prevents the ball from driving the pins beyond a limited range. The ball guide provides fine alignment horizontally and vertically enabling stable electrical performance.

Integrated circuit contactor for testing ICs and method of construction

The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. The sliding is largely longitudinal, with a small and desirable lateral component determined by the inclination of the interface.

Electrically conductive pins for microcircuit tester

A structure and method of constructing a tip for a contact pin used in IC test housing for testing integrated circuits. As the pin is deflected when the device under test (DUT) pad engaged the tip of the pin, the tip pressure normally increases as the elastomers biasing the pin are engaged. This causes the elastomer supporting the tip to increase pressure. By widening the tip as it rolls, the pressure is maintained more constant. Also, as the top wears, the pressure on the DUT will be reduced. By making the contact area of the tip to DUT smaller as it wears, the pressure can be made more constant.

Constant pressure pin tip for testing integrated circuit chips

A structure and method for providing a contact pin between a device under test (DUT) and a load board which provides upper and lower contact point which are axial aligned is disclosed. The pin has an upper () and lower () section and a hinge () in between which allow flex of both upper and lower contact () which, but the axial alignment can provide a direct replacement for POGO pins but with greater reliability. It also includes a structure and method for removing upper pinsby use of a modified hinge

On-center electrically conductive pins for integrated testing

The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane with a top facing the device under test, a bottom facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The bottom pins has a lower contact surface which includes an arcuate portion or ridge which increases contact pressure and ablates oxides by the rocking action of ridge when the DUT in inserted.

Electrically conductive pins microcircuit tester

Resilient interposer with electrically conductive slide-by pins as part of a microcircuit tester

A structure and method of constructing a tip for a contact pin used in IC test housing for testing integrated circuits. As the pin is deflected when the device under test (DUT) pad engaged the tip of the pin, the tip pressure normally increases as the elastomers biasing the pin are engaged. This causes uneven pressure on the tip and will create debris and reduce tip life. By making the surface of the tip wider in the X or Y direction the surface pressure is reduced during the pin contact cycle. It is also possible to reduce tip pressure by having the top surface change in the Z axis so that recedes downwardly along its travel path, the pressure is reduced.

Constant stress pin tip for testing integrated circuit chips

A structure and method for providing a contact pin between a device under test (DUT) and a load board which provides upper and lower contact point which are axial aligned is disclosed. The pin has an upper () and lower () section and a hinge in between which allow flex of both upper and lower contact () which, but the axial alignment can provide a direct replacement for POGO pins but with greater reliability. It also includes a structure and method for removing upper pinsby use of a modified hinge. In an alternate embodiment, the lower section includes a leg extensionand a sliding contact landwhich slides against an aperture in the housing. A spacerprovides space for decoupling components on the load board. The hinge may include a truncated cylinderwhich is configured to permit remove of the upper pin without removal of the lower.

A structure and method for providing a contact pin between a device under test (DUT) and a load board which provides upper and lower contact point which are axial aligned is disclosed. The pin has an upper () and lower () section and a hinge () in between which allow flex of both upper and lower contact () which, but the axial alignment can provide a direct replacement for POGO pins but with greater reliability.

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Brooklyn Park, MN, United States of America

John E Nelson