Atotech Usa, Inc.

Atotech Deutschland Gmbh

John E McCaskie

Nicholas Michael Martyak

Michael T Boyle

Nayan E Joshi

A high current density electrogalvanizing process and composition are disclosed for reducing high current density dendrite formation and controlling high current density roughness, grain size and orientation of a zinc coating obtained from an acidic aqueous zinc salt. The process comprises adding a sulfonated condensation product of naphthalene and formaldehyde to the acidic aqueous zinc salt in an electrolytic cell and applying an electromotive force to the anode and cathode in the cell sufficient to produce a high current density on the cathode. The composition consists essentially of an acidic aqueous zinc salt aqueous in combination with a sulfonated condensation product of naphthalene and formaldehyde which is used as an antidendritic agent.

High current density zinc sulfate electrogalvanizing process and composition

Removal of orthophosphite ions from electroless nickel plating baths

The disclosure relates to treating a self accelerating and replenishing immersion composition on a substrate with a neutralizing and reducing composition comprising an acid and a salt of an inorganic or organic amine, and then electrolytically coating the treated surface with a metal. The salts in one embodiment comprise salts of hydroxylamine or hydrazine and the acid comprises a mineral acid.

Composition and process for treating a surface coated with a

A high current density electrogalvanizing process and composition are disclosed for reducing high current density dendrite formation and edge burn and controlling high current density roughness, grain size and orientation of a zinc coating obtained from a zinc sulfate aqueous acidic electrogalvanic coating bath. The composition comprises a high molecular weight polyoxyalkylene glycol grain refining agent in combination with a sulfonated condensation product of naphthalene and formaldehyde which is used as an antidendritic agent.

High current density zinc sulfate electrogalvanizing process and

An electrogalvanizing process and composition are disclosed for reducing high current density dendrite (HCD) formation and edge burn and controlling high current density roughness, grain size and orientation of a zinc coating obtained from a zinc halide aqueous acidic electrogalvanic coating bath. A low molecular weight polyoxyalkylene glycol homopolymer or copolymer based on 3 to about 4 carbon atom alkylene oxides as a grain refining agent in combination with a sulfonated condensation product of naphthalene and formaldehyde which is used as an antidendritic agent. A glycol compound comprising a high molecular weight polyoxyalkylene glycol homopolymer or copolymer, a depolarizer such as an aniline compound, and a carbamate compound comprising a di-lower alkyl dithio carbamyl lower alkyl sulfonic acid may also be used, optionally in combination with an aldehyde and/or a grain refining agent such as a low molecular weight polyoxyalkylene glycol homopolymer or copolymer and/or an antidendritic agent comprising a sulfonated condensation product of naphthalene and formaldehyde. HCD zinc coatings applied according to the process described herein will be smoother when using a sulfonated naphthalene formaldehyde antidendritic agent and a low molecular weight ethylene oxide polymer grain refining agent by increasing the antidendritic agent to an amount greater than the grain refining agent. A boron oxide composition can be used to further reduce HCD burn and a lignin compound to increase brightness.

High current density zinc chloride electrogalvanizing process and

A process for applying a metal coating to a non-conductive substrate without an electroless coating is disclosed. The process includes the step of: a. contacting said substrate with an activator comprising a noble metal/Group IVA metal sol to obtain a treated substrate; b. contacting said treated substrate with a self accelerating and replenishing immersion metal composition comprising a solution of (i) a soluble metal salt whose metal is more noble than said Group IVA metal, (ii) a Group IA metal hydroxide, (iii) a complexing agent comprising an organic material having a cumulative formation constant log K of from about 0.73 to about 21.95 for an ion of the metal of said metal salt. The Group IVA metal is employed in a stoichiometric excess compared to the noble metal, the excess Group IVA metal being in its lowest oxidation state. Self accelerating and replenishing non-formaldehyde immersion metal compositions are also disclosed. The composition is used in a two step process to electrolytically coat a nonconductive substrate. In the first step the conductivity of the substrate is increased by applying the composition to it. In the second step, the substrate treated with the composition is electrolytically coated with a metal.

Growing community of inventors

Princeton, NJ, United States of America

John E McCaskie