Phillips Petroleum Company

John E Leland

James S Dix

Donald G Needham

Paul J Boeke

Jennings P Blackwell

Robert S Shue

Robert J Martinovich

Robert D Still

Roy F Wright

Harold D Boultinghouse

Robert E Benefield, Jr

Electronic components can be encapsulated with a poly(arylene sulfide) composition containing a mercaptosilane such as, for example, 3-mercaptopropyltrimethoxysilane.

Encapsulation of electronic components with poly(arylene sulfide)

Zinc titanate is used in poly(arylene sulfide) compositions to improve encapsulation properties. Electronic components are encapsulated with poly(arylene sulfide) compositions containing zinc titanate.

Zinc titanate in poly(arylene sulfide) compositions

Zinc titanate in poly (arylene sulfide) compositions

Zinc oxide is used in poly(arylene sulfide compositions to improve encapsulation properties and to inhibit color shift. The invention includes electronic components encapsulated with poly(arylene sulfide) compositions containing zinc oxide.

Zinc oxide in poly(arylene sulfide) compositions

Poly(arylene sulfide) compositions are disclosed having a combination of good cracking resistance and electrical insulation resistance. Such compositions have a variety of uses including uses in molded electrical components.

Poly(arylene sulfide) composition with improved insulation resistance

The six compositions, nickel-antimony-titanium, lead chromate-lead molybdate, quinacridone, monoazo-nickel complex, cobalt-zinc-silica, and lead chromate, provide a polyarylene sulfide composition containing one or more of these with high contrast laser printability.

Laser printable polyarylene sulfide compositions process for

Poly(arylene sulfide) substrates are laser treated, i.e., treated with a beam of laser radiation, and then contacted with plating solution. In a specific embodiment, laser treatment imparts a specific pattern on the poly(arylene sulfide) substrate, which is then subjected to an electroless plating solution to give a printed circuit board.

Plating poly(arylene sulfide) surfaces

Articles, such as electrical circuits or elements, are encapsulated by melting polyarylene sulfide in combination with at least one print compound such as monazo-nickel complex, lead chromate-lead molybdate, quinacridone, Ni--Sb--Ti, Co--Zn--SiO.sub.2 or lead chromate, injecting this molten composition around the article to be encapsulated, and cooling and solidifying the molten composition. The articles may latter be laser printed.

Process for encapsulating articles with optional laser printing

A printed circuit board is made of poly(arylene sulfide) board and a conductive metal deposited on the board by electroless plating. Adhesion between the poly(arylene sulfide) and the conductive metal is improved by allowing the plated poly(arylene sulfide) to age.

Poly(arylene sulfide) printed circuit boards

At least one of certain silanes is added to a poly(arylene sulfide) composition. The silane increases the electrical insulation resistance of the composition.

Poly(arylene sulfide) compositions

An electrical insulation composition containing poly(arylene sulfide) and talc having a median particle size not exceeding about 4 microns.

Poly(arylene sulfide) containing talc

An electrical insulation composition containing poly(arylene sulfide), titanium dioxide and 3-mercaptopropyltrimethoxysilane.

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Bartlesville, OK, United States of America

John E Leland