Bae Systems Information and Electronic Systems Integration Inc.

Blackberry Corporation

Research in Motion Corporation

Paratek Microwave Incorporated

John E King

Chen J Zhang

Luna H Chiu

Pierre-Alain S Auroux

Tadd C Kippeny

Michael J Bowers, Ii

Barry Treadway

George Kang

Louise C Sengupta

Somnath Sengupta

Robert A Burton

Christopher S Badorrek

Myeongseob Kim

Laura A Swafford

Christopher L Rector

Barry W Treadway

Siddharth Singh

Idan Mandelbaum

James A Stobie

Don A Harris

A photon-activated quantum dot capacitor and method of fabrication. A photon-activated quantum dot capacitor photodetector having a read only integrated circuit; and a photon-activated quantum dot capacitor chip hybridized with the read only integrated circuit, wherein said photon-activated quantum dot capacitor chip comprises colloidal quantum dots that detect photons as a change in a dielectric constant of the colloidal quantum dots of the photon-activated quantum dot capacitor chip, including the further implementation of a photodetector.

Photo-activated quantum dot capacitor photodetectors

A method for detection and identification of a chemical using a preconcentrator to collect a sample of the chemical, process said sample of the chemical, and introduce said processed chemical into a chemical analysis instrument for the detection of and identification of the chemical. A system for detecting and identifying a chemical comprising a preconcentrator having at least dual concentrating elements.

Chemical preconcentrator with integrated heat source for enhanced chemical analysis

In the method for scrubbing a chemical from a medium, wherein the improvement comprises the steps of using a carbide derived carbon to adsorb the chemical which may later be released by heating. The carbide derived carbon may be a powder, a fiber, a solid foam, a mesh, or other solid form. The carbide derived carbon can adsorb a chemical in the gaseous, liquid, particulate, or aerosol phase.

Carbide derived carbon for use in chemical scrubbers

The present invention involves the use of nanoporous carbons derived from partially or fully demetalized metal carbides in personal protection equipment for the reversible absorption/adsorption of both broad and specific targeted gases. These materials have been specifically processed to provide enhanced effective loadings against specific harmful volatile organic compounds.

Superadsorbent material system for improved filtration applications

The present invention involves the use of nanoporous carbons derived from partially or fully demetalized metal carbides in personal protection equipment for the irreversible absorption/adsorption of both broad and specific targeted gases. These materials have been specifically processed to provide enhanced effective loadings against specific harmful volatile organic compounds.

An embodiment of the present invention provides a method of applying patterned metallization to a ceramic block comprising applying a photodefinable ink to said ceramic block; drying said ink; exposing said photodefinable ink to UV radiation through a predefined mask according to the thickness of the film to form a pattern; developing said pattern in a developer solution thereby forming a patterned ceramic block; and rinsing, drying and firing said patterned ceramic block.

Method of applying patterned metallization to block filter resonators

A tunable dielectric chip, and method of manufacture therefore, that comprises a dielectric substrate, the dielectric substrate patterned to a critical dimension, a metallized portion integral to the dielectric substrate, and an encapsulant covering an any portion of the dielectric substrate not covered by the metallized portion. A thin titanium layer can be deposited in between the metallized portion and the dielectric substrate to promote adhesion. The dielectric substrate can be a dielectric thick film. The thickness of the titanium can vary from 200A to 500A and the metallized portion integral to the dielectric substrate in a preferred embodiment is gold and varies in thickness from 3 um to several microns depending on the application. Further, in the present preferred embodiment, the encapsulant is a photo-definable encapsulant. The present invention also provides solder pads integral to the metallized portion enabling maximan protection from moisture and other contaminants. The metallized portion discussed above in a preferred embodiment is formed by cleaning the surface of the thick film tunable dielectric, applying a photoresist coating of a thin film metal to the thick film tunable dielectric, soft baking the thick film tunable dielectric with the thin film metal coated thereon, exposing the thick film tunable dielectric with the thin film metal coated thereon, post exposure baking the thick film tunable dielectric with the thin film metal coated thereon; and developing the thick film tunable dielectric with the thin film metal coated thereon.

Fabrication of Parascan tunable dielectric chips

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Ellicott City, MD, United States of America

John E King