International Business Machines Corporation

Lenovo (singapore) Pte. Ltd.

John E Kelly, Iii

Gerald Keith Bartley

David R Motschman

Joseph Paul Kuczynski

Arvind Kumar Sinha

Kevin Albert Splittstoesser

Charles Luther Johnson

Timothy Jerome Tofil

Charles D Johnson

Timothy A Tofil

The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip, and a heat removal device thermally connected to the thermal interface material pad.

Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance

The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip and nanofibers aligned perpendicular to mating surfaces of the first chip and the second chip.

Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks

The exemplary embodiments of the present invention provide a method and apparatus for enhancing the cooling of a chip stack of semiconductor chips. The method includes creating a first chip with circuitry on a first side and creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The method further includes creating a cavity in a second side of the first chip between the connectors and filling the cavity with a thermal material. The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes wherein portions of a second side of the first chip between the connectors is removed to provide a cavity in which a thermal material is placed.

Method and system for internal layer-layer thermal enhancement

Growing community of inventors

Poughquag, NY, United States of America

John E Kelly, Iii