Growing community of inventors

Vestal, NY, United States of America

John E Danek

Average Co-Inventor Count = 2.02

ph-index = 6

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 122

John E DanekKoenraad Alexander Gieskes (8 patents)John E DanekPeter Joseph Dionne (6 patents)John E DanekCharles Andrew Coots (3 patents)John E DanekMichael D Snyder (1 patent)John E DanekKoen Alexander Gieskes (1 patent)John E DanekDarrin Michael Weiss (1 patent)John E DanekCharles E Johnson (1 patent)John E DanekStanislaw Wladyslaw Janisiewicz (1 patent)John E DanekJames W Tripp (1 patent)John E DanekGeorge D Eck (1 patent)John E DanekMichael J Gorenflo (1 patent)John E DanekRandy S Cole (1 patent)John E DanekDaniel Joseph Hibbard (1 patent)John E DanekJohn E Danek (20 patents)Koenraad Alexander GieskesKoenraad Alexander Gieskes (23 patents)Peter Joseph DionnePeter Joseph Dionne (9 patents)Charles Andrew CootsCharles Andrew Coots (8 patents)Michael D SnyderMichael D Snyder (18 patents)Koen Alexander GieskesKoen Alexander Gieskes (8 patents)Darrin Michael WeissDarrin Michael Weiss (5 patents)Charles E JohnsonCharles E Johnson (4 patents)Stanislaw Wladyslaw JanisiewiczStanislaw Wladyslaw Janisiewicz (3 patents)James W TrippJames W Tripp (2 patents)George D EckGeorge D Eck (2 patents)Michael J GorenfloMichael J Gorenflo (2 patents)Randy S ColeRandy S Cole (1 patent)Daniel Joseph HibbardDaniel Joseph Hibbard (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Universal Instruments Corporation (17 from 151 patents)

2. Delaware Capital Formation, Inc. (3 from 655 patents)


20 patents:

1. 11464146 - Dispensing head, nozzle and method

2. 11464147 - Spindle module, pick-and-place machine and method of assembly

3. 11457549 - Spindle module, bank, and method

4. 11412646 - Spindle bank, pick-and-place machine and method of assembly

5. 11382248 - Dispensing head

6. 11375651 - Dispensing head, nozzle and method

7. 11363748 - Printed circuit board transport

8. 10058018 - Flexible assembly machine, system and method

9. 9986670 - Flexible assembly machine, system and method

10. 9955618 - Pick and place head with internal vaccum and air pressure supply, system and method

11. 9814170 - Flexible assembly machine, system and method

12. 7836582 - Printed circuit board assembly machine

13. 7267382 - Low maintenance vacuum generation

14. 6848338 - High acceleration spindle drive and method of using same

15. 6820325 - Integrated air flow control for a pick and place spindle assembly

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as of
12/31/2025
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