E.i. Dupont De Nemours and Company

Cda Processing Limited Liability Company

Dupont Electronics, Inc.

Du Pont Toray Company Limited

E.i. Du Pont De Nmeours and Company

John Donald Summers

Brian C Auman

Thomas Eugene Dueber

William Robert Corcoran

Wilson Tam

Esther Kim

Hikaru Uno

Nora Sabina Radu

Munirpallam Appadorai Subramanian

Jay Robert Dorfman

Frank L Schadt, Iii

Michael Henry Howard, Jr

Michael Stephen Wolfe

Mark A Guidry

Brian Douglas Mather

Greg A Hostetler

Hee Hyun Lee

Bryan Benedict Sauer

Kenji Uhara

Dave Hui

Hoang Vi Tran

Yuefei Tao

Naofumi Yasuda

John R Dodd

Kouichi Sawasaki

Nyrissa S Rogado

Richard Frederich Sutton, Jr

Ma Helen Cativo

Tsutomu Mutoh

Xin Fang

Shiobal Banerjee

Chai Kit Ngai

Disclosed is a polyimide having a repeat unit structure of Formula III In Formula III: Rrepresents one or more different tetracarboxylic acid component residues; and Rrepresents one or more different aromatic diamine residues or aromatic diisocyanate residues. 5-100 mol % of Rhas Formula II In Formula II: Ris H, halogen, cyano, hydroxyl, alkyl, heteroalkyl, alkoxy, heteroalkoxy, fluoroalkyl, silyl, hydrocarbon aryl, substituted hydrocarbon aryl, heteroaryl, substituted heteroaryl, ally, or vinyl; Ris halogen, cyano, hydroxyl, alkyl, heteroalkyl, alkoxy, heteroalkoxy, fluoroalkyl, silyl, hydrocarbon aryl, substituted hydrocarbon aryl, heteroaryl, substituted heteroaryl, ally, or vinyl; Rand Rare the same or different and are alkyl, fluoroalkyl, or silyl; x and y are the same or different and are an integer from 0-2; and * indicates a point of attachment.

Polymers for use in electronic devices

A conductive paste composition comprises (i) an inorganic powder comprising at least a conductive powder, (ii) at least one microgel polymer, and (iii) a solvent. The paste composition may be used in a process for manufacturing an electrical device comprising: preparing a substrate; applying the conductive paste onto the substrate in a preselected pattern; and heating the applied conductive paste to form a conductive structure that provides an electrode for connecting the device. The paste composition beneficially permits the formation of narrow, high aspect ratio features in the conductive structure.

Conductive paste composition and semiconductor devices made therewith

A method of manufacturing a solar cell electrode comprising steps of: preparing a semiconductor substrate, applying a conductive paste onto the light receiving side of the semiconductor substrate, wherein the conductive paste comprises (i) a conductive powder, (ii) a glass frit, (iii) an organic polymer comprising an elastomer and (iv) an organic solvent; and firing the applied conductive paste.

Solar cell electrode

A method of manufacturing an electrical device comprising steps of: preparing a substrate; applying a conductive paste onto the substrate, wherein the conductive paste comprises (i) an inorganic powder comprising at least a conductive powder, (ii) an organic polymer, (iii) a solvent and (iv) a gellant selected from the group consisting of a polyalkyleneoxy terminated polyamide (PAOPA), an ester terminated polyamide (ETPA), polyether polyamine (PEPA) and a mixture thereof; and heating the applied conductive paste to form an electrode.

Method of manufacturing electrical device

The present invention uses a silver/silver chloride composition and ink jet technology in the art of digital printing, especially for use in blood glucose sensors.

Ink jettable silver/silver chloride compositions

A conductive metal composition comprising 40 to 88 wt % of silver particles having an average particle size in the range of 10 to 100 nm and having an aspect ratio of 3 to 1:1, 2 to 20 wt % of a poly(2-ethyl-2-oxazoline) resin having a weight-average molar mass of 50,000 to 500,000 and 10 to 58 wt % of a solvent for the poly(2-ethyl-2-oxazoline) resin.

Conductive metal composition

This invention provides a method for using a polymer thick film copper conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film copper conductor composition to photonic sintering. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to photonic sintering. The invention further provides devices containing electrical conductors made by these methods. The invention also provides a polymer thick film copper conductor composition.

Photonic sintering of polymer thick film copper conductor compositions

This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.

Screen-printable encapsulants based on polyhydroxyamides that thermally convert to polybenzoxazoles

This disclosure relates to compositions and methods for using such compositions to provide protective coatings, particularly of electronic components. Fired-on-foil ceramic capacitors coated with a polybenzoxazole encapsulant which may be embedded in printed wiring boards are disclosed.

Screen-printable encapsulants based on soluble polybenzoxazoles

This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns a fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.

Composite organic encapsulants

Water absorption resistant polyimide/epoxy-based compositions, like pastes (or solutions), are particularly useful to make electronic screen-printable materials and electronic components. A group of hydrophobic epoxies (and soluble polyimides) was discovered to be particularly resistant to moisture absorption. The polyimide/epoxy pastes made with these epoxies (and these polyimides) may optionally contain thermal crosslinking agents, adhesion promoting agents, blocked isocyanates, and other inorganic fillers. The polyimide/epoxy pastes of the present invention can have a glass transition temperature greater than 250&#xb0; C., a water absorption factor of less than 2%, and a positive solubility measurement.

Composition of polyimide and sterically-hindered hydrophobic epoxy

Resistor compositions are disclosed, made from polymer thick film resistor formulations comprising a polyimide component, a sterically hindered hydrophobic epoxy component and a solvent component having a Hanson polar solubility parameter between 2.1 and 3.0 and having a normal boiling point between 210 and 260&#xb0; C. The weight ratio of polyimide component ('A') to epoxy component ('B') is A:B, where A is between and including 1 to 15 and where B is 1.

Resistor compositions for electronic circuitry applications

Water absorption resistant polyimide pastes (or solutions), are particularly useful to make electronic screen printable pastes and the electronic components made from these pastes. A group of soluble polyimides and their solvents were discovered to be particularly resistant to moisture absorption. These polyimide solutions optionally contain polyimides also containing cross-linkable monomers and/or thermal cross-linking agents. In addition, these polyimide pastes may optionally contain adhesion promoting agents, blocked isocyanates, metals, metal oxides, and other inorganic fillers. The polyimide pastes (or solutions) of the present invention have a polyimide with a glass transition temperature greater than 250&#xb0; C., have a water absorption factor of less than 2%, and a have a positive solubility measurement.

Polyimide compositions having resistance to water sorption, and methods relating thereto

The substrates of the present invention comprise a polyimide base polymer derived at least in part from collinear monomers together with crankshaft monomers. The resulting polyimide material has been found to provide advantageous properties, particularly for electronics type applications.

High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto

The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4'-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

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Chapel Hill, NC, United States of America

John Donald Summers