Altera Corporation

John DiCosola

Adam J Wright

Peter Boyle

Paul J Tracy

Qi Chen

Binh Vo

Michael Harms

Kaiyu Ren

Laiq Chughtai

Wan-Pin Hung

Seng Yew Lim

Eric C Chang

Mandrita Brahmachari

Techniques are provided for isolating failed routing resources on a programmable circuit. Failing test patterns and the test logs are fed to a Statistical Failure Isolation (SFI) tool. The SFI tool extracts failing paths from the test patterns. A statistical analysis is performed on interconnect resources related to failing paths. The resources on the paths are then tallied to create a histogram of resources. These resources are then be fed into an Adaptive Failure Isolation (AFI) tool to auto-generate verification patterns. A tester uses the verification patterns to isolate failed interconnect resources.

Functional failure analysis techniques for programmable integrated circuits

The present invention is a novel method and computer program product which utilizes an interface capacitor formed by the metal of the probe tip, a dielectric layer, such as an oxide, formed by a contaminant on a solder bump and the metal of the solder bump. The interface capacitor forms a capacitive divider with the inherent capacitances of the automatic test equipment and the device under test (DUT). The voltage characteristics of the capacitive divider are used to drive voltage signals across the interface capacitor to test the DUT. In either direction (i.e. from the automatic test equipment to the DUT or vice versa), by altering the voltage output high amplitude of the driver and/or the voltage input high amplitude of the load, the DUT is validly tested through the interface capacitor. Thus, even if all I/O bumps have an oxide layer, the device may still be validly tested.

Method of maintaining signal integrity across a capacitive coupled solder bump

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Pleasanton, CA, United States of America

John DiCosola