Lucent Technologies Inc.

Enpirion, Inc.

Modular Power Technology, Inc.

Altera Corporation

Other

At+t Corp.

Agere Systems Inc.

Agere Systems Guardian Corp.

Fitel USA Corporation

Triquint Technology Holding Co.

Empirion, Inc.

Modular Power Technoogy, Inc.

John David Weld

Ashraf W Lotfi

Mathew A Wilkowski

Douglas D Lopata

Trifon M Liakopoulos

William Roger Lambert

Dhammika L Perera

Matthew Wilkowski

Nagesh R Basavanhally

Lloyd Shepherd

Jeffrey Demski

Anatoly Feygenson

Robert LeRoy Decker

Jay Norton

Edwin Arthur Chandross

Paul Joseph Lemaire

Jon W Engelberth

Philip J Hubbauer

Wei Zhang

Alan Michael Lyons

Paul Robert Kolodner

Cristian A Bolle

George J Shevchuk

Robert Joseph Roessler

Louis Thomas Manzione

William Lonzo Woods, Jr

Mark Anthony Paczkowski

Shiaw-Jong Steve Chen

Whitney Ryan White

Ephraim Suhir

Choong Kit Wong

Ronald Edward Scotti

Donald W Dahringer

Yong-Kwan Park

Lennart Daniel Pitzele

Rene R Ruel

David J Kudelko

Teik Wah Lim

Gerard Edmond Henein

Hong Tang

Karl Erich Wolf

Felix C Anigbo

Paul M Rominski

Anpei Pan

Moon Soo Park

Embodiments of the present disclosure include an apparatus having a band including a high thermally conductive material is disposed at least partially around an inductor.

Apparatus for an inductor disposed in a band for method of heat dispersion

Embodiments of the present disclose a power module system including a power module operatively coupled to an integrated circuit die, where the power module includes a band comprising of a high thermally conductive material disposed around an inductor and where the band is at least partially disposed around the inductor.

Apparatus for power module and heat dissipation of an integrated circuit

A method of forming a power module located on a conductive substrate by providing power conversion circuitry. The method of providing the power conversion circuitry includes forming a magnetic device by placing a magnetic core proximate a conductive substrate with a surface thereof facing a conductive substrate, and placing a conductive clip proximate a surface of the magnetic core. The method of forming the magnetic device also includes electrically coupling ends of the conductive clip to the conductive substrate to cooperatively form a winding therewith about the magnetic core. The method of providing the power conversion circuitry also includes providing at least one switch on the conductive substrate. The method of forming the power module also includes depositing an encapsulant about the power conversion circuitry.

Method of forming a power module with a magnetic device having a conductive clip

A packaged integrated circuit and method of forming the same. The package integrated circuit includes an integrated circuit formed on a semiconductor die affixed to a surface of a multi-layer substrate, and a switch-mode regulator formed on the semiconductor die (or another semiconductor die) affixed to the surface of the multi-layer substrate. The integrated circuit and the switch-mode regulator are integrated within a package to form the packaged integrated circuit.

Packaged integrated circuit including a switch-mode regulator and method of forming the same

A semiconductor device having substantially minor-symmetric terminals and methods of forming the same. In one embodiment, the semiconductor device includes a semiconductor switch having a control node and a switched node, the switched node being coupled to first and second output terminals of the semiconductor device, the first and second output terminals being positioned in a substantially minor-symmetric arrangement on the semiconductor device. The semiconductor device also includes a control element having first and second input nodes and an output node, the first and second input nodes being coupled to first and second input terminals, respectively, of the semiconductor device and the output node being coupled to the control node of the semiconductor switch, the first and second input terminals being substantially center-positioned on the semiconductor device.

Semiconductor device having mirror-symmetric terminals and methods of forming the same

A semiconductor device and method of forming the same including, in one embodiment, a semiconductor die formed with a plurality of laterally diffused metal oxide semiconductor ('LDMOS') cells. The semiconductor device also includes a redistribution layer electrically coupled to the plurality of LDMOS cells and a plurality of metallic pillars distributed over and electrically coupled to the redistribution layer.

Semiconductor device including a redistribution layer and metallic pillars coupled thereto

A semiconductor device and method of forming the same including, in one embodiment, a semiconductor die formed with a plurality of laterally diffused metal oxide semiconductor ('LDMOS') cells, and a metallic layer electrically coupled to the plurality of LDMOS cells. The semiconductor device also includes a plurality of gate drivers positioned along a periphery of the semiconductor die and electrically coupled to gates of the plurality of LDMOS cells through the metallic layer.

Semiconductor device including gate drivers around a periphery thereof

A semiconductor device and method of forming the same including, in one embodiment, a substrate and a plurality of source and drain regions formed as alternating pattern on the substrate. The semiconductor device also includes a plurality of gates formed over the substrate between and parallel to ones of the plurality of source and drain regions. The semiconductor device also includes a first plurality of alternating source and drain metallic strips formed in a first metallic layer above the substrate and parallel to and forming an electrical contact with respective ones of the plurality of source and drain regions.

Semiconductor device including alternating source and drain regions, and respective source and drain metallic strips

A module having a discrete passive element and a semiconductor device, and method of forming the same. In one embodiment, the module includes a patterned leadframe, a discrete passive element mounted on an upper surface of the leadframe, and a thermally conductive, electrically insulating material formed on an upper surface of the discrete passive element. The module also includes a semiconductor device bonded to an upper surface of the thermally conductive, electrically insulating material.

Module having a stacked passive element and method of forming the same

A method of forming a magnetic device by providing a conductive substrate and placing a magnetic core proximate the conductive substrate with a surface thereof facing the conductive substrate. The method also includes placing a conductive clip proximate a surface of the magnetic core and electrically coupling ends of the conductive clip to the conductive substrate to cooperatively form a winding therewith about the magnetic core.

Method of forming a magnetic device having a conductive clip

A method of manufacturing a power module on a substrate. In one embodiment, the method includes providing power conversion circuitry including providing a magnetic device having a magnetic core and at least one switch on the substrate. The method also includes placing a shielding structure with a baffle over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about the power conversion circuitry. The shielding structure limits the encapsulant entering the chamber and the baffle directs the encapsulant away from the magnetic core thereby limiting an amount of the encapsulant that contacts the magnetic core within the chamber.

Method of manufacturing a power module

A magnetic device that includes a magnetic core having a surface facing a conductive substrate. The magnetic device also includes a conductive clip facing a surface of the magnetic core with ends of the conductive clip electrically coupled to the conductive substrate to cooperatively form a winding therewith about the magnetic core.

Magnetic device having a conductive clip

Growing community of inventors

Succasunna, NJ, United States of America

John David Weld