Kemet Electronics Corporation

Motorola Corporation

Kemet Corporation

Kamet Electronics Corporation

Motorola Solutions, Inc.

John D Prymak

Chris Stolarski

Gregory Joseph Dunn

Michael Randall

Antony P Chacko

Azizuddin Tajuddin

Chris Wayne

Alethia Melody

Philip Michael Lessner

Garry L Renner

Robert T Croswell

Remy J Chelini

Peter Par Blais

Eric Jayson Young

Jim Piller

Michael Prevallet

George Haddox

John Tony Kinard

Yongjian Qiu

Jeffrey Poltorak

Christian L Guerrero

David W Jacobs

Randy Hahn

Lance Paul Thornton

Alethla Melody

James C Bates, Jr

Michael D Prevallet

A capacitor assembly with a substrate having a first face and a second face. A multiplicity of capacitors are mounted on the first face wherein each capacitor has a first lead and a second lead of opposite polarity to the first lead. A bridge is in electrical contact with multiple first leads. A tree is in electrical contact with the bridge wherein the tree passes through a via of the substrate and is in electrical contact with a first trace of the second face. A second trace is on the second face wherein the second lead is in electrical contact with the second trace.

Concentrated capacitor assembly

A ceramic multilayer surface-mount capacitor with inherent crack mitigation void patterning to channel flex cracks into a safe zone, thereby negating any electrical failures.

Capacitor comprising flex crack mitigation voids

A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.

Electronic passive device

A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.

Substrate with embedded patterned capacitance

A capacitive interposer, electronic package having the capacitive interposer and electronic device with the electronic package is described. The interposer has a first planar face and a second planar face. An array of upper connections is on the first planar face and opposing lower connections are on the second planar face with conduction paths between each upper connection of the upper connections and a lower connection of the lower connections. At least one power feed-through capacitor is provided. The capacitor has a plurality of parallel plates with a dielectric there between. At least one first external termination is in electrical contact with a first set of alternate parallel plates and at least one second external termination is in electrical contact with a second set of alternate parallel plates. The capacitor is mounted on the first planar face with the first external termination in direct electrical contact with a first upper connection and the second external termination is in direct electrical contact with a second upper connection. At least one upper connection, first external termination and second external termination are arranged for direct electrical contact with element contact pads of a common element.

A Zener diode&#x2014;capacitor combination wherein a Zener diode is mounted in the capacitor body and connected in parallel with the capacitor after the capacitor has been voltage tested. A welded strap or jumper wire completing the diode circuit or a connection of separate terminations during soldering may be used to complete the circuit.

Multiple electronic components: combination capacitor and Zener diode

A Zener diode-capacitor combination wherein a Zener diode is mounted in the capacitor body and connected in parallel with the capacitor after the capacitor has been voltage tested. A welded strap or jumper wire completing the diode circuit or a connection of separate terminations during soldering may be used to complete the circuit.

An improved method for forming a capacitor. The method includes the steps of: providing a metal foil; forming a dielectric on the metal foil; applying a non-conductive polymer dam on the dielectric to isolate discrete regions of the dielectric; forming a cathode in at least one discrete region of the discrete regions on the dielectric; and cutting the metal foil at the non-conductive polymer dam to isolate at least one capacitor comprising one cathode, one discrete region of the dielectric and a portion of the metal foil with the discrete region of the dielectric.

Thin solid electrolytic capacitor embeddable in a substrate

Porous sintered anode bodies for capacitors formed from valve metals are treated by electrolysis to form a dielectric layer and coated with cathode layers. When standard parallelpiped shapes are used, cathode coverage at the edges and corners is non-uniform and failures occur at those locations. Rectangular prisms, obround prisms and cylindrical prisms are formed with transition surfaces at edges and corners, such as chamfers and curves, to enhance cathode layer uniformity. The transition surface greatly enhances the application of polymer slurries.

Anodes with corner and edge modified designs

Embedded capacitors comprise a bimetal foil () that includes a first copper layer () and an aluminum layer () on the first copper layer. The aluminum layer has a smooth side adjacent the first copper layer and a high surface area textured side () opposite the first copper layer. The bimetal foil further includes an aluminum oxide layer () on the high surface area textured side of the aluminum layer, a conductive polymerlayer () on the aluminum oxide layer, and a second copper layer () overlying the aluminum oxide layer. The bimetal foil may be embedded in a circuit board () to form high value embedded capacitors.

Embedded capacitors and methods for their fabrication and connection

A low inductance multi-layer capacitor. The capacitor includes interleaved parallel internal electrode plates with dielectric there between. Each internal electrode plate includes two lead-out tabs and is generally T shaped. A first external electrode terminal is electrically connected to the lead-out tabs of the even internal electrode plates, and a second external electrode terminal is electrically connected to the lead-out tabs of the odd internal electrode plates. The external electrode terminals are on a common first exterior surface and a common opposing second exterior surface of the capacitor.

Growing community of inventors

Greer, SC, United States of America

John D Prymak